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參數資料
| 型號： | APF19-19-13CB/A01 |
| 廠商： | CTS Thermal Management Products |
| 文件頁數： | 1/2頁 |
| 文件大小： | 0K |
| 描述： | HEATSINK FORGED W/ADHESIVE TAPE |
| 產品目錄繪圖： | APF-19-19-13CB Series |
| 標準包裝： | 300 |
| 系列： | APF |
| 類型： | 頂部安裝 |
| 冷卻式包裝： | 分類（BGA，LGA，CPU，ASIC……） |
| 固定方法： | 散熱帶，粘合劑（含） |
| 形狀： | 方形 |
| 長度： | 0.748"（19.00mm） |
| 寬： | 0.748"（19.00mm） |
| 機座外的高度（散熱片高度）： | 0.500"（12.70mm） |
| 在強制氣流下的熱敏電阻： | 在 200 LFM 時為4.0°C/W |
| 材質： | 鋁 |
| 材料表面處理： | 黑色陽極化處理 |
| 產品目錄頁面： | 2681 (CN2011-ZH PDF) |
| 其它名稱： | 294-1150 |
Page 1 of 2
October 2006
IERC a CTS Company
413 North Moss Street
Burbank, CA 91502
818-842-7277
www.ctscorp.com
Series APF Low Height Thin Fin Forged Heat Sink
Part Number
Fin Matrix
(Rows x Columns)
Length x Width x Height
(mm)
Thermal Resistance
(°C/Watt @ 200 LFPM)
Pressure Drop
(Inches of
Water)
APF19-19-06CB
12 X 2
19 x 19 x 6.3
7.05
.033
APF19-19-10CB
12 X 2
19 x 19 x 9.5
5.25
.033
APF19-19-13CB
12 X 2
19 x 19 x 12.7
3.95
.033
APF30-30-06CB
19 x 3
30 x 30 x 6.3
4.35
.039
APF30-30-10CB
19 x 3
30 x 30 x 9.5
3.25
.039
APF30-30-13CB
19 x 3
30 x 30 x 12.7
2.45
.039
APF40-40-06CB
26 x 4
40 x 40 x 6.3
3.30
.043
APF40-40-10CB
26 x 4
40 x 40 x 9.5
2.50
.043
APF40-40-13CB
26 x 4
40 x 40 x 12.7
1.90
.043
TAPE STYLES
Material: Nylon Plastic per UL94-V0
Thermal
Tape
Supplier
Thickness
(mm)
Thermal Impedance
(°C-in/W)
Dielectric
Strength (V/mil)
Description
A01
IERC
0.13
0.82
4,000
Double-sided acrylic adhesive on a Kapton MT
carrier.
T410
Chomerics
0.18
1.10
N/A
Double-sided acrylic adhesive loaded
w/aluminum oxide on an aluminum foil carrier.
T411
Chomerics
0.28
1.00
N/A
Double-sided silicone adhesive with expanded
aluminum mesh carrier.
T412
Chomerics
0.23
0.25
N/A
Double-sided acrylic adhesive loaded w/
titanium diboride on an expanded aluminum
carrier.
Features
Precision Forging Technology for
High Power Applications
Low Profile Thin Fins
Designed for BGA and Other Surface
Mount Packages
Select from Multiple Fin Heights
Improved Thermal Performance
Over Conventional Heat Sinks
Product Benefits
No Special Tools Needed for Assembly
No Additional Holes Required On the
PCB
Adhesive Tape Mounting Convenience
Series APF Low Height Thin-Fin
Forged Heat Sinks
Technical
Data
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