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參數(shù)資料
| 型號(hào)： | BR3363K |
| 廠商： | STANLEY ELECTRIC CO., LTD. |
| 英文描述： | Single Color Semi-Round Shape Type |
| 中文描述： | 單色半圓形型 |
| 文件頁(yè)數(shù)： | 1/33頁(yè) |
| 文件大小： | 430K |
| 代理商： | BR3363K |
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Page 1
3363K Series
Single Color Semi-Round Shape Type
Recommended Applications
Amusement Equipment, Electric Household Appliances, OA/FA, Other General Applications
Outer Dimension 2
×
3 Semi-Round shape type
Operation temperature range.
Storage Temperature
Operating Temperature
Lead–free soldering compatible
RoHS compliant
Green
: 558nm (MBG)
567nm (MPG)
Yellow Green
: 572nm (MPY)
Yellow
: 590nm (MAY)
Orange
: 606nm (MAA)
Red
: 624nm (MVR)
647nm (BR)
:-30
℃～
100
℃
:-30
℃～
85
℃
Dominant wavelength
630nm (MPR)
Product features
Half Intensity Angle
Die materials
MBG, MPG, MPY, MPR : GaP
MAY, MAA, MVR : GaAsP
BR : GaAlAs
Sorted by luminous intensity per rank taping
MBG :
θ
x=34 deg.
θ
y=31 deg.,
MPY :
θ
x=30 deg.
θ
y=23 deg.,
MAA :
θ
x=39 deg.
θ
y=28 deg.,
BR :
θ
x=35 deg.
θ
y=30 deg.,
MPG
θ
x=28 deg.
θ
y=23 deg.
MAY
θ
x=36 deg.
θ
y=32 deg.
MVR
θ
x=36 deg.
θ
y=28 deg.
MPR
θ
x=35 deg.
θ
y=28 deg.
Features
Package
2
×
3 Semi-Round shape type,
MBG,MPG : Pale Green Clear epoxy
MPY,MAY : Pale Yellow Clear epoxy
MAA : Pale Orange Clear epoxy
MVR,BR,MPR : Pale Red Clear epoxy
Rank grouping parameter
Soldering methods
ESD
Packing
TTW (Through The Wave) soldering and manual soldering
More than 2kV(HBM)
Bulk : 200pcs(MIN.)
2006.7.31
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