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參數資料
| 型號： | C0805C100C1GAC |
| 廠商： | KEMET Corporation |
| 英文描述： | CERAMIC CHIP CAPACITORS |
| 中文描述： | 陶瓷芯片電容器 |
| 文件頁數： | 1/4頁 |
| 文件大小： | 82K |
| 代理商： | C0805C100C1GAC |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
49
C
KEMET
CERAMIC CHIP CAPACITORS
C 0805 C 103 K
5 R
A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF
J – ±5%
C – ±0.25pF
K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
P – (GMV) – special order only
G – ±2%
Z – +80%, -20%
L #
W #
WIDTH
B
S
MOUNTING
TECHNIQUE
Solder Reflow
LENGTH
1.0 (.04) ± .05(.002)
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
MIN. SEPARATION
0.3 (.012)
0.5 (.02) ± .05 (.002)
1.6 (.063) ± 0.15 (.006)
0.8 (.032) ± 0.15 (.006)
0.35 (.014) ±0.15 (.006)
0.7 (.028)
2.0 (.079) ± 0.2 (.008)
1.25 (.049) ± 0.2 (.008)
0.5 (.02) ±.25 (.010)
0.75 (.030)
Soldor
3.2 (.126) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
0.5 (.02) ±.25 (.010)
N/A
Solder Reflow
3.2 (.126) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
0.5 (.02) ±.25 (.010)
N/A
4.5 (.177) ± 0.3 (.012)
3.2 (.126) ± 0.3 (.012)
0.6 (.024) ±.35 (.014)
N/A
4.5 (.177) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
N/A
5.6 (.220) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
N/A
5.6 (.220) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
N/A
DIMENSIONS
—
MILLIMETERS AND (INCHES)
CAPACITOR ORDERING INFORMATION
C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
10, 16, 25, 50, 100 and 200 Volts
Standard End Metalization: Tin-plate over nickel
barrier
Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
Tape and reel packaging per EIA481-1. (See page
61 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
FEATURES
CAPACITOR OUTLINE DRAWINGS
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1 - 100V
2 - 200V
5 - 50V
(14 digits - no spaces)
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
W
L
T
B
S
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
ELECTRODES
* Part Number Example: C0805C103K5RAC
*Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)
#Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.
For extended value 1210 case size
– solder reflow only.
Solder
Reflow
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
(Standard Chips - For
Military see page 55)
See pages
48-52 for
thickness
dimensions.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| C0805C100C1GAC TM | 制造商:KEMET Corporation 功能描述:CAP 10PF 100VDC C0G 0.25PF SMD 0805 - Tape and Reel |
| C0805C100C1GAC7800 | 制造商:KEMET Corporation 功能描述: |
| C0805C100C1GACTU | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 100volts 10pF C0G 0.25% RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產品:Low ESR MLCCs 封裝:Reel |
| C0805C100C2GAC | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 10.0PF 200V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產品:Low ESR MLCCs 封裝:Reel |
| C0805C100C2GAC7800 | 制造商:KEMET Corporation 功能描述: |
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