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參數資料
型號: CY7C1526V18-167BZC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 72-Mbit QDR⑩-II SRAM 4-Word Burst Architecture
中文描述: 8M X 9 QDR SRAM, 0.5 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數: 1/23頁
文件大小: 374K
代理商: CY7C1526V18-167BZC
PRELIMINARY
72-Mbit QDR-II SRAM 4-Word Burst
Architecture
CY7C1513V18
CY7C1515V18
CY7C1526V18
CY7C1511V18
Cypress Semiconductor Corporation
Document #: 38-05363 Rev. *A
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised August 11, 2004
Features
Separate Independent Read and Write Data Ports
— Supports concurrent transactions
250-MHz Clock for High Bandwidth
4-Word Burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both Read and
Write Ports (data transferred at 500 MHz) at 250 MHz
Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
Two output clocks (C and C) accounts for clock skew
and flight time mismatching
Echo clocks (CQ and CQ) simplify data capture in high
speed systems
Single multiplexed address input bus latches address
inputs for both Read and Write ports
Separate Port Selects for depth expansion
Synchronous internally self-timed writes
Available in ×8,x9, ×18, and ×36 configurations
Full data coherency providing most current data
Core Vdd=1.8(+/-0.1V);I/O Vddq=1.4V to Vdd)
15 × 17 x 1.4 mm 1.0-mm pitch FBGA package, 165-ball
(11 × 15 matrix)
Variable drive HSTL output buffers
JTAG 1149.1 Compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1511V18–8M x 8
CY7C1526V18–8M x 9
CY7C1513V18–4M x 18
CY7C1515V18–2M x 36
Functional Description
The CY7C1511V18, CY7C1526V18, CY7C1513V18, and
CY7C1515V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II architecture. QDR-II architecture
consists of two separate ports to access the memory array.
The Read port has dedicated Data Outputs to support Read
operations and the Write Port has dedicated Data Inputs to
support Write operations. QDR-II architecture has separate
data inputs and data outputs to completely eliminate the need
to “turn-around” the data bus required with common I/O
devices. Access to each port is accomplished through a
common address bus. Addresses for Read and Write
addresses are latched on alternate rising edges of the input
(K) clock. Accesses to the QDR-II Read and Write ports are
completely independent of one another. In order to maximize
data throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with four 8-bit words (CY7C1511V18) or 9-bit
words (CY7C1526V18) or 18-bit words (CY7C1513V18) or
36-bit words (CY7C1515V18) that burst sequentially into or
out of the device. Since data can be transferred into and out
of the device on every rising edge of both input clocks (K and
K and C and C), memory bandwidth is maximized while simpli-
fying system design by eliminating bus “turn-arounds”.
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
相關PDF資料
PDF描述
CY7C1526V18-200BZC 72-Mbit QDR⑩-II SRAM 4-Word Burst Architecture
CY7C1526V18-250BZC 72-Mbit QDR⑩-II SRAM 4-Word Burst Architecture
CY7C1512-25ZC 64K x 8 Static RAM
CY7C1512-15SC 64K x 8 Static RAM
CY7C1512-15ZC 64K x 8 Static RAM
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CY7C1543KV18-400BZI 功能描述:靜態隨機存取存儲器 72MB (4Mx18) 1.8v 400MHz QDR II 靜態隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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CY7C1543V18-333BZC 功能描述:靜態隨機存取存儲器 72M Q2+ B4 (2.0) RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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