
DS30445 Rev. 1 - 2
1 of 3
DFLS130
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
Diodes Incorporated
DFLS130
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
SPICE MODEL: DFLS130
PowerDI
123
B
A
A
C
E
L4
L
L1
E
H
D
L3
L2
L
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
@ T
A
= 25 C unless otherwise specified
Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward
Voltage Drop
Mechanical Data
Characteristic
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current @ T
T
= 120°C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
30
V
21
1.0
V
A
I
FSM
22
A
P
D
P
D
R
JA
R
JA
R
JS
T
j
T
STG
1.67
556
60
180
10
W
mW
°C/W
C/W
°C/W
C
°C
-55 to +125
-55 to +150
Case: PowerDI 123, Plastic
Plastic Material: UL Flammability
Classification Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Polarity: Cathode Band
Terminals: Matte Tin Finish (Lead Free),
Solderable per MIL-STD-202, Method 208
Marking: Date Code & Type Code, See Page 3
Type Code: F01
Weight: 0.01 grams (approx.)
Ordering Information: See Page 3
T
C
U
D
O
R
P
W
E
N
Electrical Characteristics
@ T
A
= 25 C unless otherwise specified
Characteristic
Symbol
V
(BR)R
Min
30
Typ
Max
Unit
V
Test Condition
I
R
= 1.5mA
I
F
= 0.1A
I
F
= 0.7A
I
F
= 1.0A
V
R
= 30V, T
A
= 25 C
V
R
= 10V, f = 1.0MHz
Reverse Breakdown Voltage (Note 4)
Forward Voltage (Note 4)
V
F
0.25
0.33
0.36
0.15
40
0.37
0.42
1.0
V
Leakage Current (Note 4)
Total Capacitance
I
R
C
T
mA
pF
Features
Notes: 1. Part mounted on 2"x2" GETEK board with 1"x1" copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website
3. Theoretical R JS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
PowerDI 123
Min
3.50
2.60
1.63
0.93
0.85
0.15
0.45
—
—
—
0.90
All Dimensions in mm
Dim
A
B
C
D
E
H
L
L1
L2
L3
L4
Max
3.90
3.00
1.93
1.00
1.25
0.25
0.85
—
—
—
1.30
Typ
3.70
2.80
1.78
0.98
1.00
0.20
0.65
1.35
1.10
0.20
1.05