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DS30583 Rev. 2 - 2
1 of 3
DFLS230LH
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
Diodes Incorporated
B
A
A
C
E
L4
L
L1
E
H
D
L3
L2
L
Maximum Ratings
@ T
A
= 25 C unless otherwise specified
Mechanical Data
Characteristic
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Operating Temperature Range
Storage Temperature Range
30
V
21
2.0
V
A
I
FSM
75
A
T
j
-65 to +150
-65 to +150
C
T
STG
°C
Case: PowerDI 123
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Last Page
Ordering Information: See Last Page
Weight: 0.01 grams (approx.)
N
PowerDI 123
Min
3.50
2.60
1.63
0.93
0.85
0.15
0.45
—
—
—
0.90
All Dimensions in mm
Dim
A
B
C
D
E
H
L
L1
L2
L3
L4
Max
3.90
3.00
1.93
1.00
1.25
0.25
0.85
—
—
—
1.30
Typ
3.70
2.80
1.78
0.98
1.00
0.20
0.65
1.35
1.10
0.20
1.05
Characteristic
Symbol
V
(BR)R
Min
30
Typ
Max
Unit
V
Test Condition
I
R
= 200 A
I
F
= 2A, T
j
= 25 C
I
F
= 2A, T
j
= 125 C
V
R
= 30V, T
j
= 25 C
V
R
= 30V, T
j
= 100 C
V
R
= 10V, f = 1.0MHz
Reverse Breakdown Voltage (Note 3)
Forward Voltage (Note 3)
V
F
0.45
0.375
0.200
15
V
Leakage Current (Note 3)
I
R
6
mA
Total Capacitance
C
T
85
pF
DFLS230LH
2.0A HIGH EFFICIENCY SCHOTTKY BARRIER RECTIFIER
PowerDI
123
Features
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
Very Low V
F
and High Current Capability
Low Leakage Current
High Surge Capability
Lead Free Finish, RoHS Compliant (Note 4)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Characteristic
Symbol
R
JS
Typ
Max
6
Unit
°C/W
Thermal Resistance Junction to Soldering (Note 2)
Thermal Characteristics
Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf.
2. Theoretical R
JS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
3. Short duration pulse test to minimize self-heating effect.
4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7
Electrical Characteristics
@ T
A
= 25 C unless otherwise specified
@ T
A
= 25 C unless otherwise specified