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參數(shù)資料
| 型號(hào)： | DG188BA |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類(lèi)： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | High-Speed Drivers with JFET Switch |
| 中文描述： | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, MBCY10 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大小： | 75K |
| 代理商： | DG188BA |
8
DG181 Series
D16.3
MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C)
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.840
-
21.34
-
E
0.220
0.310
5.59
7.87
-
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
α
aaa
0.005
90
o
-
0.13
90
o
-
7
105
o
105
o
-
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
16
16
8
Rev. 0 4/94
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
PLANE
BASE
PLANE
D
S
S
-D-
-A-
-C-
e
A
-B-
aaa
C A - B
M
D
S
S
ccc
C A - B
M
D
S
S
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
METAL
LEAD FINISH
e
A/2
S2
M
A
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DG188BA DIE | 制造商:Harris Corporation 功能描述: |
| DG188BK | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Interface IC |
| DG188BL | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Interface IC |
| DG188BP | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:High-Speed Drivers with JFET Switch |
| DG189 | 制造商:VISHAY 制造商全稱(chēng):Vishay Siliconix 功能描述:High-Speed Drivers with Dual SPDT JFET Switches |
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