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參數資料
型號: EPF10K30EQC208-2
廠商: Altera
文件頁數: 35/100頁
文件大小: 0K
描述: IC FLEX 10KE FPGA 30K 208-PQFP
產品培訓模塊: Three Reasons to Use FPGA's in Industrial Designs
標準包裝: 72
系列: FLEX-10KE®
LAB/CLB數: 216
邏輯元件/單元數: 1728
RAM 位總計: 24576
輸入/輸出數: 147
門數: 119000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP
供應商設備封裝: 208-PQFP(28x28)
其它名稱: 544-2225
4
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
General
Description
Altera FLEX 10KE devices are enhanced versions of FLEX 10K devices.
Based on reconfigurable CMOS SRAM elements, the FLEX architecture
incorporates all features necessary to implement common gate array
megafunctions. With up to 200,000 typical gates, FLEX 10KE devices
provide the density, speed, and features to integrate entire systems,
including multiple 32-bit buses, into a single device.
The ability to reconfigure FLEX 10KE devices enables 100
% testing prior
to shipment and allows the designer to focus on simulation and design
verification. FLEX 10KE reconfigurability eliminates inventory
management for gate array designs and generation of test vectors for fault
coverage.
Table 5 shows FLEX 10KE performance for some common designs. All
performance values were obtained with Synopsys DesignWare or LPM
functions. Special design techniques are not required to implement the
applications; the designer simply infers or instantiates a function in a
Verilog HDL, VHDL, Altera Hardware Description Language (AHDL), or
schematic design file.
Table 4. FLEX 10KE Package Sizes
Device
144-
Pin
TQFP
208-Pin
PQFP
240-Pin
PQFP
RQFP
256-Pin
FineLine
BGA
356-
Pin
BGA
484-Pin
FineLine
BGA
599-Pin
PGA
600-
Pin
BGA
672-Pin
FineLine
BGA
Pitch (mm)
0.50
1.0
1.27
1.0
1.27
1.0
Area (mm2)
484
936
1,197
289
1,225
529
3,904
2,025
729
Length
× width
(mm
× mm)
22
× 22 30.6 × 30.6 34.6 × 34.6 17 × 17 35 × 35 23 × 23 62.5 × 62.5 45 × 45 27 × 27
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EPF10K30EQC2082X 制造商:ALTERA 功能描述:New
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EPF10K30EQC208-3 功能描述:FPGA - 現場可編程門陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數量: 邏輯塊數量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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