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參數資料
| 型號： | FAN5069EMTCX |
| 廠商： | Fairchild Semiconductor |
| 文件頁數： | 4/22頁 |
| 文件大小： | 622K |
| 描述： | IC REG DL BCK/LINEAR 16TSSOP |
| 產品變化通告： | Metallization Mask Rev 18/Apr/2007 |
| 標準包裝： | 2,500 |
| 拓撲： | 降壓（降壓）同步（1），線性（LDO）（1） |
| 功能： | 任何功能 |
| 輸出數： | 2 |
| 頻率 - 開關： | 200kHz |
| 電壓/電流 - 輸出 1： | 控制器 |
| 電壓/電流 - 輸出 2： | 控制器 |
| 帶 LED 驅動器： | 無 |
| 帶監控器： | 無 |
| 帶序列發生器： | 無 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | * |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應商設備封裝： | * |
| 包裝： | 帶卷 (TR) |
?2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5069 Rev. 1.1.5
4
Absolute Maximum Ratings
The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are
not guaranteed at the absolute maximum ratings. The Recommended Operating Conditions table defines the condi-
tions for actual device operation.
(1)
Notes:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are referenced to AGND.
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Thermal Information
Notes:
3. Junction-to-ambient thermal resistance, ?/DIV>
JA
, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat
sink characteristics.
Recommended Operating Conditions
Parameter
Min.
Max.
Unit
V
CC
to PGND
6.0
V
BOOT to PGND
33.0
V
SW to PGND
Continuous
-0.5
33.0
V
Transient (t < 50nS, F < 500kHz)
-3.0
33.0
V
HDRV (V
BOOT
- V
SW
)
6.0
V
LDRV
-0.5
6.0
V
All Other Pins
-0.3
V
CC
+ 0.3
V
Maximum Shunt Current for V
CC
150
mA
Electrostatic Discharge Protection (ESD)
Level
(2)
HBM
3.5
kV
CDM
1.8
Symbol
Parameter
Min.
Typ.
Max.
Unit
T
STG
Storage Temperature
-65
150
癈
T
L
Lead Soldering Temperature, 10 Seconds
300
癈
Vapor Phase, 60 Seconds
215
癈
Infrared, 15 Seconds
220
癈
P
D
Power Dissipation, T
A
= 25癈
715
mW
?/DIV>
JC
Thermal Resistance, Junction-to-Case
37
癈/W
?/DIV>
JA
Thermal Resistance, Junction-to-Ambient
(3)
100
癈/W
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
V
CC
Supply Voltage
V
CC
to GND
4.5
5.0
5.5
V
T
A
Ambient Temperature
Commercial
-10
85
癈
Industrial
-40
85
癈
T
J
Junction Temperature
125
癈
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