
L-Band Medium & High Power GaAs FET
FEATURES
High Output Power: P1dB=29.5dBm(typ.)
High Gain: G1dB=13.0dB(typ.)
Low Cost Plastic(SMT) Package
Tape and Reel Available
DESCRIPTION
The FLU10ZM is a GaAs FET designed for base station and CPE
applications. This is a new product series using a plastic surface mount
package that has been optimized for high volume cost driven applications.
Fujitsu’s stringent Quality Assurance Program assures the highest
reliability and consistent performance.
ABSOLUTE MAXIMUM RATINGS (Case Temperature Tc=25
Item
Drain-Source Voltage
℃
)
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25
℃
)
CASE STYLE: ZM
Note 1: Product supplied to this specification are 100% DC performance tested.
Note 2: The RF parameters are measured on a lot basis by sample testing 10 pcs/lot.
Acceptance Criteria:(accept/reject)=(0/1). Any lot failure shall be 100% retested.
Edition 1.1
May 2003
1
Recommended Operating Condition (Case Temperature Tc=25
℃
)
FLU10ZM
Transconductance
Limit
Typ.
Item
Symbol
Test Conditions
Unit
Drain Current
Pinch-off Voltage
Gate-Source Breakdown
Voltage
I
DSS
gm
V
p
V
GSO
mA
mS
V
dBm
Min.
-
Max.
Output Power at 1dB G.C.P.
Power Gain at 1dB G.C.P.
P
1dB
G
1dB
V
dB
-
150 -
-1.0 -2.0 -3.5
-5 -
-
28.5 29.5 -
12.0 13.0 -
V
DS
=10V,
f=2.0GHz,
I
DS
=0.6I
DSS
(Typ.)
V
DS
=5V, V
GS
=0V
Thermal Resistance
R
th
℃
/W
-
15 18
Channel to Case
ESD
Class
Ⅱ
500
~
1999 V
Note : Based on EIAJ ED-4701 C-111A (C=100pF,R=1.5k
Ω
)
Item
Symbol
V
DS
Condition
≤
10
Unit
DC Input Voltage
Channel Temperature
Forward Gate Current
Reverse Gate Current
T
ch
I
gsf
I
gsr
≤
145
≤
4.8
≥
-0.5
V
℃
mA
mA
Gate Resistance
R
g
400
Ω
300 450
V
DS
=5V, I
DS
=200mA
V
DS
=5V, I
DS
=15mA
I
GS
=-15uA
G.C.P.:Gain Compression Point
Symbol
Rating
Unit
Gate-Soutce Voltage
Total Power Dissipation
Storage Temperature
V
DS
V
GS
P
T
T
stg
15
-5
6.9
-55 to +150
V
V
W
℃
Channel Temperature
T
CH
175
℃