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參數資料
| 型號： | FMS6407MTF20X |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 消費家電 |
| 英文描述： | Triple Video Drivers with Selectable HD/Progressive/SD/Bypass Filters |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO20 |
| 封裝： | LEAD FREE, TSSOP-20 |
| 文件頁數： | 15/17頁 |
| 文件大小： | 378K |
| 代理商： | FMS6407MTF20X |
REV. 1I July 2005
15
FMS6407
DATA SHEET
Package Dimensions
TSSOP-20 and ePAD TSSOP-20
SIDE VIEW
END VIEW
TOP VIEW
SECTION "B-B"
SCALE: 120/1
(SEE NOTE 10)
EVEN LEAD SIDES
TOPVIEW
ODD LEAD SIDES
TOPVIEW
DETAIL "A"
SCALE: 30/1
(VIEW ROTATED 90° C.W.)
EXPOSED PAD VIEW
B
B
N
1.00 DIA.
7
1
2
3
1.00
1.00
D
A-B
C
0.20
C
M
bbb
A-B
9
B
A
D
E1
E
D
4
E/2
4
4
b
5
2X N/2 TIPS
A
e
A
1
5
A
2
SEATING
PLANE
8
aaa
b1
(b)
(c)
c1
WITH PLATING
BASE METAL
0.05
3
H
C
C
C
0.25
H
6
L
PARTING
(OC)
13
P1
P
(14°)
(14°)
(1.00)
13
C
SEE DETAIL "A"
C
e/2
X
X = A AND B
X = A AND B
X
D
8.
7.
CONTROLLING DIMENSION: MILLIMETERS.
THIS PART IS COMPLIANT WITH JEDEC SPECIFICATION MO-153
VARIATIONS AA/AAT, AB-1/ABT-1, AB/ABT, AC/ACT, AD/ADT, AE/AET
BC-1/BCT-1, BD-1/BDT-1, BE/BET, CA/CAT & CD/CDT
AND MO-194 VARIATIONS AC/ACT & AF/AFT.
11.
12.
1.
2.
DIE THICKNESS ALLOWABLE IS 0.279±0.0127 (.0110±.0005 INCHES)
DIMENSIONING & TOLERANCES PER ASME. Y14.5M-1994.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE
0.07mm TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION
AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND AN ADJACENT LEAD SHOULD
BE 0.07mm FOR 0.65MM PITCH, 0.08MM FOR 0.50MM PITCH AND
0.07MM FOR 0.40MM PITCH PACKAGES. SEE SECTION "B-B".
THE LEAD WIDTH DIMENSION DOES NOT INCLUDE DAMBAR
9.
ONE ANOTHER WITHIN 0.076mm AT SEATING PLANE.
6.
5.
3.
FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FOR SOLDERING TO A SUBSTRATE.
DIMENSION IS THE LENGTH OF TERMINAL
ON E PER SIDE.
FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15mm ON D AND 0.25mm
PROTRUSIONS, AND ARE MEASURED AT THE BOTTOM PARTING LINE. MOLD
"D" & "E1" ARE REFERENCE DATUM AND DO NOT INCLUDE MOLD FLASH OR
DATUM PLANE H LOCATED AT MOLD PARTING LINE AND COINCIDENT
WITH LEAD, WHERE LEAD EXITS PLASTIC BODY AT BOTTOM OF PARTING LINE.
TO 0.25 MM FROM THE LEAD TIP.
SECTION "B-B" TO BE DETERMINED AT 0.10
10.
DATUM A-B AND D TO BE DETERMINED WHERE CENTERLINE
BETWEEN LEADS EXITS PLASTIC BODY AT DATUM PLANE H.
4.
END USER SHOULD VERIFY AVAILABLE SIZE OF EXPOSED PAD FOR SPECIFIC
DEVICE APPLICATION.
SHOWN ARE MAXIMUM SIZE OF EXPOSED PAD WITHIN LEAD COUNT AND BODY SIZE.
DIMENSIONS "P" AND "P1" ARE THERMALLY ENHANCED VARIATIONS. VALUES
13.
NOTES:
Common Dimensions
MIN.
MAX.
1.10
Note
L
N
A1
A2
aaa
E
e
E1
D
c
b
A
NOM.
0.65 BSC
6.40 BSC
0.90
0.076
0.20
0.16
6.60
0.30
0.25
0.15
0.95
0.05
0.85
0.19
0.19
0.09
0.09
6.40
4.30
4.40
4.50
0.50
0.60
20
0.70
b1
bbb
0.22
0.10
c1
SYM
6
7
5
5
9
0.127
6.50
0°
P1
C
O
P
3.0
4.2
13
13
8°
Note:
For 0.65mm pitch.
All dimensions in millimeters.
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