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參數資料
| 型號： | GS816118D-166 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁數： | 1/40頁 |
| 文件大?。?/td> | 1391K |
| 代理商： | GS816118D-166 |
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 9/26/02
GS816118/32/36D
Supplemental Datasheet Information
This supplemental information applies to the GS816118/36T datasheet, which you will
find attached to this document. This supplement includes a new package offering (the
165-bump BGA—Package D), as well as an additional organization (x32, which is only
offered in the 165 BGA for this part).
相關PDF資料 |
PDF描述 |
|---|---|
| GS816118D-166I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-200 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| GS816118D-200I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-225 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-225I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
相關代理商/技術參數 |
參數描述 |
|---|---|
| GS816118D-166I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-200I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-225 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-225I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
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