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參數(shù)資料
型號(hào): GS816236BD-200I
廠商: GSI TECHNOLOGY
元件分類: DRAM
英文描述: 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
中文描述: 512K X 36 CACHE SRAM, 6.5 ns, PBGA165
封裝: FBGA-165
文件頁數(shù): 14/37頁
文件大小: 866K
代理商: GS816236BD-200I
GS816218/36B(B/D)
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.04 9/2005
14/37
2004, GSI Technology
V
DDQ3
Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
V
DD
Input High Voltage
V
IH
2.0
V
DD
+ 0.3
V
1
V
DD
Input Low Voltage
V
IL
0.3
0.8
V
1
V
DDQ
I/O Input High Voltage
V
IHQ
2.0
V
DDQ
+ 0.3
V
1,3
V
DDQ
I/O Input Low Voltage
V
ILQ
0.3
0.8
V
1,3
Notes:
1.
The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
Input Under/overshoot voltage must be
2 V > Vi < V
DDn
+1.5 V maximum, with a pulse width not to exceed 50% tKC.
V
IHQ
(max) is voltage on V
DDQ
pins plus 0.3 V.
2.
3.
V
DDQ2
Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
V
DD
Input High Voltage
V
IH
0.6*V
DD
V
DD
+ 0.3
V
1
V
DD
Input Low Voltage
V
IL
0.3
0.3*V
DD
V
1
V
DDQ
I/O Input High Voltage
V
IHQ
0.6*V
DD
V
DDQ
+ 0.3
V
1,3
V
DDQ
I/O Input Low Voltage
V
ILQ
0.3
0.3*V
DD
V
1,3
Notes:
1.
The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
Input Under/overshoot voltage must be
2 V > Vi < V
DDn
+1.5 V maximum, with a pulse width not to exceed 50% tKC.
V
IHQ
(max) is voltage on V
DDQ
pins plus 0.3 V.
2.
3.
Recommended Operating Temperatures
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Ambient Temperature (Commercial Range Versions)
T
A
0
25
70
°
C
2
Ambient Temperature (Industrial Range Versions)
T
A
40
25
85
°
C
2
Notes:
1.
The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
Input Under/overshoot voltage must be
2 V > Vi < V
DDn
+1.5 V maximum, with a pulse width not to exceed 50% tKC.
2.
相關(guān)PDF資料
PDF描述
GS816236BD-250 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816236BD-250I 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816236BGB-150 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816236BGB-150I 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816236BGB-200 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816236BD-225M 制造商:GSI Technology 功能描述:GS816236BD-225M - Trays
GS816236BD-250 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 2.5V/3.3V 18MBIT 512KX36 5.5NS/2.5NS 165FBGA - Trays
GS816236BD-250I 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 2.5V/3.3V 18MBIT 512KX36 5.5NS/2.5NS 165FBGA - Trays
GS816236BD-250IV 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 2.5V/3.3V 18MBIT 512KX36 5.5NS/2.5NS 165FPBGA - Trays
GS816236BD-250M 制造商:GSI Technology 功能描述:GS816236BD-250M - Trays
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