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參數資料
| 型號： | GTL2005PW |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 電壓/頻率轉換 |
| 英文描述： | Quad GTL-GTL+ to LVTTL-TTL bidirectional non-latched translator |
| 封裝： | GTL2005PW/DG<SOT402-1 (TSSOP14)|<<http://www.nxp.com/packages/SOT402-1.html<1<Always Pb-free,;GTL2005PW<SOT402-1 (TSSOP14)|<<http://www.nxp.com/packages/SOT402-1.html< |
| 文件頁數： | 15/19頁 |
| 文件大小： | 116K |
| 代理商： | GTL2005PW |
GTL2005_7
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 3 February 2009
15 of 19
NXP Semiconductors
GTL2005
Quad GTL/GTL+ to LVTTL/TTL bidirectional non-latched translator
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 12
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
and
10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 12
.
Table 9.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 10.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關代理商/技術參數 |
參數描述 |
|---|---|
| GTL2005PW,112 | 功能描述:轉換 - 電壓電平 4-BIT BI-DIREC RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2005PW,118 | 功能描述:轉換 - 電壓電平 XLATR QUAD BI-DIREC RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2005PW,118-CUT TAPE | 制造商:NXP 功能描述:GTL2005 Series 3.3 V Quad Bidirectional Non-Latched Translator - TSSOP-14 |
| GTL2005PW/DG,118 | 功能描述:轉換 - 電壓電平 4-BIT BI-DIREC RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2005PW/DG118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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