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參數(shù)資料
| 型號(hào)： | HC4P5509A1R3060 |
| 廠商： | INTERSIL CORP |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | SLIC Subscriber Line Interface Circuit |
| 中文描述： | TELECOM-SLIC, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大小： | 61K |
| 代理商： | HC4P5509A1R3060 |
10
HC5509A1R3060
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allow-
able mold protrusion is 0.010 inch (0.25mm) per side.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
contact point.
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
-C-
Plastic Leaded Chip Carrier Packages (PLCC)
N28.45
(JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495
12.32
12.57
-
D1
0.450
0.456
11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495
12.32
12.57
-
E1
0.450
0.456
11.43
11.58
3
E2
0.191
0.219
4.86
5.56
4, 5
N
28
28
6
Rev. 1 3/95
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| HC4P5524-9 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
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