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參數(shù)資料
| 型號： | HCTS365D |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| 中文描述： | 輻射硬化六角緩沖器/線路驅(qū)動器非反相 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大小： | 200K |
| 代理商： | HCTS365D |
10
HCTS365MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS365MS
OE1
(1)
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS365 is TA14413A.
A1
(2)
A2 (4)
Y2 (5)
A3 (6)
Y3
(7)
GND
(8)
Y4
(9)
(12) A5
(13) Y6
(14) A6
NC
OE2
(15)
VCC
(16)
(11) Y5
Y1
(3)
NC
NC
NC
A4
(10)
Spec Number
518637
相關PDF資料 |
PDF描述 |
|---|---|
| HCTS365DMSR | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365K | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365KMSR | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365MS | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365HMSR | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HCTS365DMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365HMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365K | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365KMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365MS | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
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