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參數資料
| 型號： | HSDL-3021-021 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數據兼容低功耗4.0 Mbit / s的紅外遙控器 |
| 文件頁數： | 14/26頁 |
| 文件大小： | 205K |
| 代理商： | HSDL-3021-021 |
14
Adjacent Land Keepout and Solder
Mask Areas
Adjacent land keepout is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm. It is recommended that
two fiducial crosses be placed at
Recommended Metal solder Stencil
Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See
Table 1 below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 3.05 mm x 1.1 mm as per land
pattern.
Figure 3. Solder stencil aperture.
Table 1.
Aperture Size(mm)
Stencil Thickness, t (mm)
Length, l
1.75
±
0.05
2.4
±
0.05
Width, w
0.55
±
0.05
0.55
±
0.05
0.127 mm
0.11 mm
APERTURES AS PER
LAND DIMENSIONS
l
w
t
mid length of the pads for unit
alignment.
Note:
Wet/Liquid Photo-imaginable
solder resist/mask is recommended.
h
l
j
k
SOLDER MASK
DIMENSION
h
l
k
j
mm
0.2
3.0
3.85
10.1
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