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參數(shù)資料
| 型號： | HSDL-3021-021 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外遙控器 |
| 文件頁數(shù)： | 17/26頁 |
| 文件大小： | 205K |
| 代理商： | HSDL-3021-021 |
17
Appendix C: General Application
Guide for the HSDL-3021 infrared
IrDA Compliant 4 Mb/s Transceiver
Description
The HSDL-3021, a wide-voltage
operating range infrared
transceiver is a low-cost and small
form factor device that is
designed to address the mobile
computing market such as PDAs,
as well as small embedded mobile
products such as digital cameras
and cellular phones. It is
spectrally suited to universal
remote control transmission
function at 940 nm typically. It is
fully compliant to IrDA 1.4 low
power specification up 4Mb/s and
support most remote control
codes. The design of HSDL-3021
also includes the following unique
features :
Spectrally suited to universal
remote control transmission
function at 940 nm typically
Low passive component count
Shutdown mode for low power
consumption requirement
Direct interface with I/O logic
circuit
Selection of Resistor R2
Resistor R2 should be selected to
provide the appropriate peak
pulse IR and RC LED current
respectively at different ranges of
V
CC
as shown on page 3 under
“Recommended Application
circuit components.”
Interface to the Recommended I/O
Chip
The HSDL-3021’s TXD data input
is buffered to allow for CMOS
drive levels. No peaking circuit or
capacitor is required. Data rate
from 9.6 kb/s to 4 Mb/s is
available at RXD pin. The
TXD_RC, pin 7, together with
LEDA, pin1, is used to select the
remote control transmit mode.
Alternatively, the TXD_IR, pin 3,
together with LEDA, pin 1, is used
for infrared transmit selection.
Following shows the hardware
reference design with HSDL-3021.
*Detailed configuration of HSDL-
3021 with the controller chip is
shown in Figure 3.
The use of the infrared tech-
niques for data communication
has increased rapidly lately and
almost all mobile application
processors have built in the IR
port. This does away with the
external Endec and simplifies the
interfacing to a direct connection
between the processor and the
transceiver. The next section
discusses interfacing
configuration with a general
processor.
Figure 2: Mobile application platform.
LOGIC BUS
DRIVER
MEMORY
EXPANSION
ROM
FLASH
SDRAM
MOBILE
APPLICATION
CHIPSET
IrDA
INTERFACE
AC97
SOUND
BASEBAND
CONTROLLER
I2S
TOUCH PANEL
AUDIO INPUT
POWER
MANAGEMENT
PCM SOUND
LCD BACKLIGHT
PANEL
ANTENNA
STN/TFT
LCD PANEL
KEY PAD
LCD CONTROL
A/D
PERIPHERIAL INTERFACE
PWM
MEMORY I/F
*HSDL-3021
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| HSDL-3200#021 | 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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| HSDL-3201 | 制造商:LITEON 制造商全稱:Lite-On Technology Corporation 功能描述:IrDA? Data 1.4 Low Power Compliant 115.2 kb/s Infrared Transceiver |
| HSDL-3201#001 | 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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