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參數資料
| 型號： | HSMJ-A401-U40M1 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | SMT LED Surface Mount LED Indicator |
| 中文描述： | 表面貼裝LED表面貼裝LED指示燈 |
| 文件頁數： | 6/9頁 |
| 文件大小： | 1197K |
| 代理商： | HSMJ-A401-U40M1 |
6
Figure 9a. Recommended SnPb Reflow Soldering Profile.
Figure 10. Recommended Wave Soldering Profile.
Figure 8a. Recommended Soldering Pad Pattern.
240
°
C MAX.
20 SEC. MAX.
3
°
C/SEC.
MAX.
120 SEC. MAX.
TIME
T
183
°
C
100-150
°
C
–
6
°
C/SEC.
MAX.
60-150 SEC.
3
°
C/SEC. MAX.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
Thermal Resistance
300
°
C/W
350
°
C/W
470
°
C/W
Solder Pad Area (xy)
>16 mm
2
>12 mm
2
>8 mm
2
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
Note:
For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060
Surface
Mounting SMT LED Indicator Components
.
217
°
C
MAX. 120 SEC.
6
°
C/SEC. MAX.
3
°
C/SEC. MAX.
125
°
C ± 25
°
C
255
°
C
60 to 150 SEC.
10 to 20 SEC.
TIME
T
* THE TIME FROM 25
°
C TO PEAK TEMPERATURE = 6 MINUTES MAX.
+5
°
C
-0
°
C
LHOT AIR KNIFE
BOTTOM SIDE
TOP SIDE OF
TURBULENT WAVE
FLUXING
PREHEAT
0
10
20
30
50
100
150
200
250
30
40
50
TIME
–
SECONDS
T
–
°
C
60
70
80
90
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150
C (100
C PCB)
C
°
C
SOLDER WAVE TEMPERATURE = 245
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
2.60
(0.103)
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
4.50 (0.178)
Y
X
0.40 (0.016)
X
0.50
(0.020)
Y
1.10
(0.043)
1.50 (0.059)
DIMENSIONS IN mm (INCHES).
X
X
0.5 (0.020)
Y
Y
1.0 (0.039)
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
2.8 (0.110)
6.1 (0.240)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
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