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參數資料
| 型號： | HUF76113T3ST |
| 廠商： | INTERSIL CORP |
| 元件分類： | 功率晶體管 |
| 英文描述： | 4.7A, 30V, 0.031 Ohm, N-Channel, Logic Level UltraFET Power MOSFET(4.7A, 30V, 0.031 Ω,N溝道,邏輯電平,UltraFET功率MOS場效應管) |
| 中文描述： | 4.7 A, 30 V, 0.038 ohm, N-CHANNEL, Si, POWER, MOSFET |
| 文件頁數： | 8/12頁 |
| 文件大小： | 175K |
| 代理商： | HUF76113T3ST |
8
Intersil provides thermal information to assist the designer’s
preliminary application evaluation. Figure 23 defines the
R
θ
JA
for the device as a function of the top copper
(component side) area. This is for a horizontally positioned
FR-4 board with 1oz copper after 1000 seconds of steady
state power with no air flow. This graph provides the
necessary information for calculation of the steady state
junction temperature or power dissipation. Pulse
applications can be evaluated using the Intersil device Spice
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve. Displayed on the curve
are R
θ
JA
values listed in the Electrical Specifications table.
The points were chosen to depict the compromise between
the copper board area, the thermal resistance and ultimately
the power dissipation, P
DM
. The smallest areas represent
the minimum bond pad area and the package outline area
respectively as determined from the package diagram
Thermal resistances corresponding to other copper areas
can be obtained from Figure 23 or by calculation using
Equation 2. R
θ
JA
is defined as the natural log of the area
times a coefficient added to a constant. The area, in square
inches is the top copper area including the gate and source
pads.
ln
×
–
=
The transient thermal impedance (Z
θ
JA
) is also effected by
varied top copper board area. Figure 24 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package.
Therefore, CTHERM1 through CTHERM5 and RTHERM1
through RTHERM5 remain constant for each of the thermal
models. A listing of the model component values is
available in Table 1.
FIGURE 23. THERMAL RESISTANCE vs MOUNTING PAD AREA
50
100
150
200
0.01
0.1
1
157
o
C/W - 0.026in
2
AREA, TOP COPPER AREA (in
2
)
R
θ
J
o
C
133
o
C/W - 0.068in
2
110
o
C/W - 0.173in
2
R
θ
JA
= 65.3 - 25 *
ln
(AREA)
(EQ. 2)
R
θ
JA
65.3
25
Area
(
)
FIGURE 24. THERMAL IMPEDANCE vs MOUNTING PAD AREA
0
20
40
60
80
100
120
10
-1
10
0
10
1
10
2
10
3
t, RECTANGULAR PULSE DURATION (s)
Z
θ
J
,
I
o
C
COPPER BOARD AREA - DESCENDING ORDER
0.077 in
2
0.308 in
2
0.535 in
2
0.760 in
2
0.996 in
2
HUF76113T3ST
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