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參數(shù)資料
| 型號(hào)： | 1-1981374-1 |
| 廠商： | Tyco Electronics |
| 元件分類： | 插座 |
| 英文描述： | LGA Sockets |
| 中文描述： | LGA插座 |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 1342K |
| 代理商： | 1-1981374-1 |
TE Connectivity’s surface mount LGA socket was designed for use with Intel’s
Core i7
LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount
onto the PCB, while the top side provides a cantilever beam interface to the package. The
integrated lever mechanism (ILM) generates the Z-axis compression load. A robust bolster
plate helps eliminate PCB bowing during compression. The sockets are validated to Intel
Design Guides.
Introducing
Sockets and Hardware for LGA 1366 Processors
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1-1981374-1 | 制造商:TE Connectivity 功能描述:Socket Cap 制造商:TE Connectivity 功能描述:SOCKET CAP |
| 1-1981458-6 | 制造商:TE Connectivity 功能描述:DYNAMIC D-5 V-HDR ASSY 4P AG XX - Rail/Tube 制造商:TE CONNECTIVITY 功能描述:DYNAMIC D-5 V-HDR ASSY 4P AG XX |
| 1-1981837-2 | 功能描述:IC 與器件插座 LGA 1366 Socket RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 1-1981837-2 | 制造商:TE Connectivity 功能描述:LGA SOCKET, 1366POS, SMD |
| 1-1981970-2 | 制造商:TE Connectivity 功能描述:GIC2.5W PLUG HOUSING 8POS (2-ROW) RED - Bag 制造商:TE CONNECTIVITY 功能描述:GIC2.5W PLUG HOUSING 8POS RED (2-ROW) |
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