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參數資料
| 型號： | IRFZ24L |
| 廠商： | International Rectifier |
| 英文描述： | HEXFET Power MOSFET |
| 中文描述： | HEXFET功率MOSFET |
| 文件頁數： | 1/10頁 |
| 文件大?。?/td> | 361K |
| 代理商： | IRFZ24L |
IRFZ24S/L
HEXFET
Power MOSFET
PD - 9.891A
l
Advanced Process Technology
l
Surface Mount (IRFZ24S)
l
Low-profile through-hole (IRFZ24L)
l
175°C Operating Temperature
l
Fast Switching
Parameter
Typ.
–––
–––
Max.
2.5
40
Units
R
θ
JC
R
θ
JA
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Thermal Resistance
°C/W
Parameter
Max.
17
12
68
3.7
60
0.40
± 20
100
4.5
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
A
W
W
W/°C
V
mJ
V/ns
V
GS
E
AS
dv/dt
T
J
T
STG
-55 to + 175
300 (1.6mm from case )
°C
Absolute Maximum Ratings
V
DSS
= 60V
R
DS(on)
= 0.10
I
D
= 17A
D2
TO-262
S
D
G
8/25/97
Description
Third Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRFZ24L) is available for low-
profile applications.
°C
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| IRFZ44L | HEXFET Power MOSFET |
| IRFZ44S | HEXFET Power MOSFET |
| IRFZ44ZLPBF | HEXFET㈢ Power MOSFET ( VDSS = 55V , RDS(on) = 13.9mヘ , ID = 51A ) |
相關代理商/技術參數 |
參數描述 |
|---|---|
| IRFZ24LPBF | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Power MOSFET |
| IRFZ24N | 制造商:IRF 制造商全稱:International Rectifier 功能描述:Power MOSFET (Vdss=55V, Rds(on)=0.07ohm, Id=17A) |
| IRFZ24N,127 | 功能描述:MOSFET N-CH 55V 17A SOT78 RoHS:是 類別:分離式半導體產品 >> FET - 單 系列:TrenchMOS™ 標準包裝:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金屬氧化物 FET 特點:邏輯電平門 漏極至源極電壓(Vdss):200V 電流 - 連續漏極(Id) @ 25° C:18A 開態Rds（最大）@ Id, Vgs @ 25° C:180 毫歐 @ 9A，10V Id 時的 Vgs(th)（最大）:4V @ 250µA 閘電荷(Qg) @ Vgs:72nC @ 10V 輸入電容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安裝類型:通孔 封裝/外殼:TO-220-3 整包 供應商設備封裝:TO-220FP 包裝:管件 |
| IRFZ24NHR | 制造商:International Rectifier 功能描述:Trans MOSFET N-CH 55V 17A 3-Pin(3+Tab) TO-220AB 制造商:International Rectifier 功能描述:TRANS MOSFET N-CH 55V 17A 3PIN TO-220AB - Rail/Tube |
| IRFZ24NL | 功能描述:MOSFET N-CH 55V 17A TO-262 RoHS:否 類別:分離式半導體產品 >> FET - 單 系列:HEXFET® 標準包裝:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金屬氧化物 FET 特點:邏輯電平門 漏極至源極電壓(Vdss):200V 電流 - 連續漏極(Id) @ 25° C:18A 開態Rds（最大）@ Id, Vgs @ 25° C:180 毫歐 @ 9A，10V Id 時的 Vgs(th)（最大）:4V @ 250µA 閘電荷(Qg) @ Vgs:72nC @ 10V 輸入電容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安裝類型:通孔 封裝/外殼:TO-220-3 整包 供應商設備封裝:TO-220FP 包裝:管件 |
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