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參數(shù)資料
| 型號(hào)： | IRHA7260 |
| 英文描述： | TRANSISTOR | MOSFET | N-CHANNEL | 200V V(BR)DSS | 43A I(D) | SMT |
| 中文描述： | 晶體管| MOSFET的| N溝道| 200伏五（巴西）直|第43A條（丁）|貼片 |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大小： | 344K |
| 代理商： | IRHA7260 |
IRHNA7260, IRHNA8260 Devices
Pre-Irradiation
2
www.irf.com
Electrical Characteristics
@ Tj = 25°C (Unless Otherwise Specified)
Parameter
Drain-to-Source Breakdown Voltage
Temperature Coefficient of Breakdown
Voltage
Static Drain-to-Source
On-State Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Min
200
—
Typ
—
0.26
Max Units
—
—
Test Conditions
VGS = 0V, ID = 1.0mA
Reference to 25°C, ID = 1.0mA
BVDSS
BVDSS/
TJ
V
V/°C
RDS(on)
—
—
2.0
9
—
—
—
—
—
—
—
—
0.070
0.077
4.0
—
25
250
VGS = 12V, ID =27A
VGS = 12V, ID = 43A
VDS = VGS, ID = 1.0mA
VDS > 15V, IDS = 27A
VDS= 0.8 x Max Rating,VGS=0V
VDS = 0.8 x Max Rating
VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
VGS =12V, ID = 43A
VDS = Max Rating x 0.5
V
VGS(th)
gfs
IDSS
S (
)
IGSS
IGSS
Qg
Qgs
Qgd
td
(on)
tr
td
(off)
tf
LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.8
100
-100
290
42
120
50
200
200
130
—
nC
VDD = 100V, ID = 43A,
RG = 2.35
LS
Internal Source Inductance
—
2.8
—
Ciss
Coss
Crss
Source-Drain Diode Ratings and Characteristics
Parameter
IS
Continuous Source Current (Body Diode)
ISM
Pulse Source Current (Body Diode)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
—
—
—
5300
1200
360
—
—
—
VGS = 0V, VDS = 25V
f = 1.0MHz
pF
nA
nH
ns
Measured from drain
lead, 6mm (0.25 in) from
package to center of die.
Measured from source
lead, 6mm (0.25 in) from
package to source bond-
ing pad.
Modified MOSFET symbol
tances.
μ
A
Min Typ
—
—
Max Units
43
172
Test Conditions
—
—
Modified MOSFET symbol showing the integral
reverse p-n junction rectifier.
VSD
trr
QRR
ton
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
—
—
—
—
—
—
1.8
820
8.5
V
ns
μ
C
T
j
= 25°C, IS = 43A, VGS = 0V
Tj = 25°C, IF = 43A, di/dt
≤
100A/
μ
s
VDD
≤
50V
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Thermal Resistance
Parameter
RthJC
Junction-to-Case
RthJ-PCB
Junction-to PC board
Min Typ Max
—
—
—
1.6
Units
Test Conditions
0.42
—
Soldered to a 1” sq. copper-clad board
°C/W
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