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參數資料
| 型號： | ISDMICROTAD-16M |
| 文件頁數： | 23/26頁 |
| 文件大小： | 1522K |
| 代理商： | ISDMICROTAD-16M |
ISD MicroTAD-16M
21
ISD
Figure 15: ISD MicroTAD-16M Bonding Physical Layout
1
(Unpackaged Die)
1.
The backside of die is internally connected to V
SS
. It
MUST NOT
be connected to any other potential or damage
may occur.
Double bond recommended.
This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
2.
3.
ISD MicroTAD-16M
I.
Die Dimensions
X: 4230 microns
Y: 9780 microns
II.
Die Thickness
(3)
11.5 ± 0.5 mils
III.
Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
V
CCD1
V
SSA
AUD OUT
AM CAP
ANA IN–
INT
V
SSA
XCLK
V
CCD2
SS
MOSI
MISO
V
SSD2
V
SSD1
ISD MicroTAD-16M
RAC
SCLK
V
SSA(2)
ANA IN+
V
CCA(2)
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