- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360998 > ISP1123BD (NXP SEMICONDUCTORS) CAP .068UF 100V PPS FILM ECH-S PDF資料下載
參數(shù)資料
| 型號(hào)： | ISP1123BD |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | CAP .068UF 100V PPS FILM ECH-S |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP32 |
| 封裝： | 7 X 7 X 1.40 MM, PLASTIC, LQFP-32 |
| 文件頁數(shù)： | 44/49頁 |
| 文件大?。?/td> | 1155K |
| 代理商： | ISP1123BD |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁當(dāng)前第44頁第45頁第46頁第47頁第48頁第49頁
Philips Semiconductors
ISP1123
USB compound hub
Preliminary specification
Rev. 01 — 5 October 1999
44 of 49
9397 750 06325
Philips Electronics N.V. 1999. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
19.2.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
19.3 Through-hole mount packages
19.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°
C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
19.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1123 | Universal Serial Bus compound hub |
| ISP1123D | Universal Serial Bus compound hub |
| ISP1123NB | Universal Serial Bus compound hub |
| ISP1130 | Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1130DL | Universal Serial Bus compound hub with integrated keyboard controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1123D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub |
| ISP1123NB | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub |
| ISP1130 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1130DL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1130N | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub with integrated keyboard controller |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。