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參數資料
| 型號： | ISP1161A1BD |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | Universal Serial Bus single-chip host and device controller |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP64 |
| 封裝： | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64 |
| 文件頁數： | 124/127頁 |
| 文件大小： | 2762K |
| 代理商： | ISP1161A1BD |
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Philips Semiconductors
ISP1161
Full-speed USB single-chip host and device controller
Product data
Rev. 01 — 3 July 2001
124 of 130
9397 750 08313
Philips Electronics N.V. 2001. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
24.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
24.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
25. Revision history
Table 124:Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
Soldering method
Wave
not suitable
not suitable
[2]
Reflow
[1]
suitable
suitable
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
PLCC
[3]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended
[3][4]
not recommended
[5]
suitable
suitable
suitable
Table 125:Revision history
Rev Date
01
20010703
CPCN
-
Description
Product data; initial version.
相關PDF資料 |
PDF描述 |
|---|---|
| ISP1161A1BM | Universal Serial Bus single-chip host and device controller |
| ISP1161BD | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161BM | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1181ABS | INDUCTOR 1.0NH +-.3NH FIXED SMD |
| ISP1181A | Full-speed Universal Serial Bus peripheral controller |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1161A1BD,118 | 功能描述:USB 接口集成電路 USB1.1 HOST &DEVICE RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161A1BD,151 | 功能描述:USB 接口集成電路 USB1.1 HOST &DEVICE RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161A1BD,157 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161A1BDFA | 功能描述:IC USB HOST CONTROLLER 64LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應商設備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1161A1BD-S | 功能描述:USB 接口集成電路 USB1.1 HOST &DEVICE CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
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