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參數(shù)資料
| 型號(hào)： | ISP1760BE |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 總線(xiàn)控制器 |
| 英文描述： | Hi-Speed Universal Serial Bus host controller for embedded applications |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP128 |
| 封裝： | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-425-1, LQFP-128 |
| 文件頁(yè)數(shù)： | 98/105頁(yè) |
| 文件大小： | 449K |
| 代理商： | ISP1760BE |
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9397 750 13257
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 8 November 2004
98 of 105
Philips Semiconductors
ISP1760
Embedded Hi-Speed USB host controller
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
17. Abbreviations
Table 104: Abbreviations
Acronym
ATL
DMA
DSC
EHCI
EMI
FS
HC
HS
INT
ISO
iTD
ITL
LS
OHCI
PDA
PLL
PIO
PTD
QHA
QHP
QHA-SS/SC
SiTD
TT
UHCI
USB
Description
Acknowledged Transfer List
Direct Memory Access
Digital Still Camera
Enhanced Host Controller Interface
Electro-Magnetic Interference
full-speed
Host Controller
high-speed
INTerrupt
isochronous
isochronous Transfer Descriptor
Isochronous (ISO) Transfer List
low-speed
Open Host Controller Interface
Personal Digital Assistant
Phase-Locked Loop
Programmed Input/Output
Philips Transfer Descriptor
Queue Head Asynchronous
Queue Head Periodic
Queue Head Asynchronous-Start Split/Start Complete
Split isochronous Transfer Descriptor
Transaction Translator
Universal Host Controller Interface
Universal Serial Bus
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1760 | Hi-Speed Universal Serial Bus host controller for embedded applications |
| ISP1761 | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP1761BE | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP1761ET | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP2100A | Telecommunication IC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1760BE,518 | 功能描述:輸入/輸出控制器接口集成電路 USB HOST CONTROLLER RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
| ISP1760BE,551 | 功能描述:輸入/輸出控制器接口集成電路 USB HS HOST CONTRLLR RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
| ISP1760BE,557 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1760BE518 | 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB HOST 128LQFP |
| ISP1760BEGA | 功能描述:IC USB CTRL HI-SPEED 128LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類(lèi)型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱(chēng):Q6396337A |
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