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參數資料
| 型號： | K9F6408Q0C-H |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; Number of Contacts:61; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight |
| 中文描述： | 8米× 8位位NAND閃存 |
| 文件頁數： | 1/29頁 |
| 文件大小： | 499K |
| 代理商： | K9F6408Q0C-H |
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FLASH MEMORY
1
K9F6408U0C
K9F6408Q0C
Document Title
8M x 8 Bit NAND Flash Memory
Revision History
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the
SAMSUNG branch office near you.
Revision No.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Remark
Advance
Preliminary
History
Initial issue.
1. I
OL
(R/B) of 1.8V device is changed.
-min. Value: 7mA -->3mA
-typ. Value: 8mA -->4mA
2. Package part number is modified.
K9F6408U0C-Y ---> K9F6408U0C_T
3. AC parameter is changed.
tRP(min.) : 30ns --> 25ns
1. TBGA package is changed.
- 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA
2. Part number(TBGA package part number) is changed
- K9F6408Q0C-D ----> K9F6408Q0C-B
- K9F6408U0C-D -----> K9F6408U0C-B
3. K9F6408U0C-BCB0,BIB0 products are added
1. WSOP1 package is added.
- Part number : K9F6408U0C_VCB0,VIBO
1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 28)
2. Add the data protection Vcc guidence for 1.8V device - below about
1.1V. (Page 29)
The min. Vcc value 1.8V devices is changed.
K9F64XXQ0C : Vcc 1.65V~1.95V --> 1.70V~1.95V
Pb-free Package is added.
K9F6408U0C-QCB0,QIB0
K9F6408U0C-HCB0,HIB0
K9F6408Q0C-HCB0,HIB0
K9F6408U0C-FCB0,FIB0
Note is added.
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for
durations of 20 ns or less.)
1. Add the Protrusion/Burr value in WSOP1
PKG Diagram
.
1. PKG(WSOP1) Dimension Change
Draft Date
Jul. 24 . 2001
Nov. 5 . 2001
Nov. 12 . 2001
Mar. 13 . 2002
Nov. 21. 2002
Mar. 05. 2003
Mar. 13 . 2003
Jul. 04. 2003
Apr. 24. 2004
May. 24. 2004
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm
相關PDF資料 |
PDF描述 |
|---|---|
| K9F6408U0A-TCB0 | TV 32C 32#20 SKT RECP |
| K9F6408U0A-TIB0 | Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:32; Connector Shell Size:19; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight |
| K9F6408U0C-F | 8M x 8 Bit Bit NAND Flash Memory |
| K9F6408U0C-H | 8M x 8 Bit Bit NAND Flash Memory |
| K9F6408U0M-TCB0 | 8M x 8 Bit NAND Flash Memory |
相關代理商/技術參數 |
參數描述 |
|---|---|
| K9F6408U0A-TCB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:8M x 8 Bit NAND Flash Memory |
| K9F6408U0A-TIB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:8M x 8 Bit NAND Flash Memory |
| K9F6408U0B | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:8M x 8 Bit NAND Flash Memory |
| K9F6408U0B-TCB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:8M x 8 Bit NAND Flash Memory |
| K9F6408U0B-TIB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:8M x 8 Bit NAND Flash Memory |
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