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| 型號(hào)： | KGF1638 |
| 廠商： | OKI SEMICONDUCTOR CO., LTD. |
| 英文描述： | Power FET (Plastic Package Type)(塑料封裝型的功率場(chǎng)效應(yīng)晶體管) |
| 中文描述： | 功率場(chǎng)效應(yīng)管（塑料包裝型）（塑料封裝型的功率場(chǎng)效應(yīng)晶體管） |
| 文件頁(yè)數(shù)： | 1/6頁(yè) |
| 文件大小： | 72K |
| 代理商： | KGF1638 |
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KGF1638
electronic components
KGF1638
Power FET (Plastic Package Type)
GENERAL DESCRIPTION
The KGF1638, housed in a SOT-89 type plastic-mold package, is a discrete GaAs power FET that
features high efficiency and high output power. The KGF1638 specifications are guaranteed to
a fixed matching circuit for 3.4 V and 850 MHz; external impedance-matching circuits are also
required. Because of its high efficiency (more than 60 %), high output power (more than 33 dBm),
and plastic package, the KGF1638 is ideal as a transmitter-final-stage amplifier for personal
handy phones, such as 3-V digital cellular phones.
FEATURES
High output power: 33 dBm (min.)
High efficiency: 70% (typ.)
Specifications guaranteed to a fixed matching circuit for 3.4 V and 850 MHz
Low thermal resistance: 20
°
C/W (typ.)
Package: 3PMMP (SOT-89 type)
PACKAGE DIMENSIONS
E2Q0036-27-X3
1.5
±
0.1
0.39
±
0.05
(Unit: mm)
4.5
±
0.1
4
±
0
2
±
0
1
±
0
+0.08
0.4
+0.08
0.4
+0.08
0.48
1.5
±
0.1 1.5
±
0.1
3
±
0.1
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
Cu
Solder plating
5
m
m or more
1.6
+0.15
This version: Jan. 1998
Previous version: Jun. 1996
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