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參數資料
| 型號： | LM4868 |
| 廠商： | National Semiconductor Corporation |
| 元件分類： | 音頻放大器 |
| 英文描述： | Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| 中文描述： | 輸出瞬態免費雙2.1W音頻放大器加上沒有耦合電容器立體聲耳機功能 |
| 文件頁數： | 11/28頁 |
| 文件大小： | 792K |
| 代理商： | LM4868 |
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Typical Performance Characteristics
(Continued)
Power Supply
Rejection Ratio
Open Loop
Frequency Response
20026721
20026722
Supply Current vs
Supply Voltage
20026723
External Components Description
( Refer to Figure 1. )
Components
1.
Functional Description
R
i
This is the inverting input resistance that sets the closed-loop gain in conjunction with R
f
. This resistor also
forms a high pass filter with C
i
at f
c
= 1/(2
π
R
i
C
i
).
This is the input coupling capacitor. It blocks the DC voltage at the amplifier’s input terminals. It also
creates a highpass filter with R
i
at f
c
= 1/(2
π
R
i
C
i
). Refer to the section,
Selecting External Components
,
for an explanation of how to determine the value of C
i
.
This is the feedback resistance. It sets the closed-loop gain in conjunction with R
i
.
This is the supply bypass capacitor. It provides power supply filtering. Refer to the
Power Supply
Bypassing
section for information concerning proper placement and selection of the supply bypass
capacitor.
This is the bypass pin capacitor. It provides half-supply filtering. Refer to the section,
Proper Selection of
External Components
, for information concerning proper placement and selection of C
B
.
2.
C
i
3.
4.
R
f
C
s
5.
C
B
Application Information
ELIMINATING OUTPUT COUPLING CAPACITORS
Typical single-supply audio amplifiers that can switch be-
tween
driving
bridge-tied-load
single-ended (SE) headphones use a coupling capacitor on
each SE output. This capacitor blocks the half-supply volt-
age to which the output amplifiers are typically biased and
(BTL)
speakers
and
couples the audio signal to the headphones. The signal
return to circuit ground is through the headphone jack’s
sleeve.
The LM4868 eliminates these coupling capacitors. Amp2A is
internally configured to apply V
/2 to a stereo headphone
jack’s sleeve. This voltage matches the quiescent voltage
present on the Amp1A and Amp1B outputs that drive the
L
www.national.com
11
相關PDF資料 |
PDF描述 |
|---|---|
| LM4868MTE | Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| LM4868LQ | Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| LM4868MT | Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| LM4883-SQ_BOM-001A | Demo Board |
| LM4891IBP | 1 Watt Audio Power Amplifier |
相關代理商/技術參數 |
參數描述 |
|---|---|
| LM4868LQ | 功能描述:IC AMP AUDIO PWR 3W STER 24LLP RoHS:否 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機，2-通道（立體聲） 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風，靜音，短路保護，音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4868MT | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| LM4868MT/NOPB | 功能描述:IC AMP AUDIO PWR 3W AB 20TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機，2-通道（立體聲） 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風，靜音，短路保護，音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4868MTE | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function |
| LM4868MTE/NOPB | 功能描述:IC AMP AUDIO PWR 3W AB 20TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機，2-通道（立體聲） 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風，靜音，短路保護，音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
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