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參數資料
型號: LT3570IFE#TRPBF
廠商: Linear Technology
文件頁數: 17/20頁
文件大小: 288K
描述: IC REG BUCK/BST/LINEAR 20TSSOP
標準包裝: 2,500
拓撲: 降壓(降壓)(1),升壓(升壓)(1),線性(LDO)(1)
功能: 車載
輸出數: 3
頻率 - 開關: 500kHz ~ 2.1MHz
電壓/電流 - 輸出 1: 可調至0.8V,1.5A
電壓/電流 - 輸出 2: 可調至0.8V,1.5A
電壓/電流 - 輸出 3: 控制器
帶 LED 驅動器:
帶監控器:
帶序列發生器:
電源電壓: 2.5 V ~ 36 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)裸露焊盤
供應商設備封裝: 20-TSSOP-EP
包裝: 帶卷 (TR)
LT3570
17
3570fb
will be enabled again going through a soft-start cycle.
Note: Overtemperature protection is intended to protect the
device during momentary overload conditions. Continuous
operation above the speci ed maximum operating junction
temperature may result in device degradation or failure.
PCB Layout
For proper operation and minimum EMI, care must be
taken during printed circuit board (PCB) layout. Figure 6
shows the high current paths in the step-down regulator
circuit. Note that in the step-down regulator, large switched
currents  ow in the power switch, the catch diode and the
input capacitor.
Figure 7 shows the high current paths in the step-up
regulator. In the boost regulator, large switched currents
 ow through the power switch, the switching diode, and
the output capacitor.
The loop formed by these large switched current com-
ponents should be as small as possible. Place these
components on the same side of the circuit board and
connect them on that layer. Place a local, unbroken ground
plane below these components and tie this ground plane
APPLICATIONS INFORMATION
Figure 6. Buck High Speed Switching Path
Figure 7. Boost High Speed Switching Path
to system ground at one location. Addi tionally, keep
the SW and BOOST nodes as small as possible. This is
implemented in the suggested layout of Figure 8 for the
QFN package which shows the topside metal from the
DC1106A demonstration board.
Thermal Considerations
To deliver the power that the LT3570 is capable of, it
is imperative that a good thermal path be provided to
dissipate the heat generated within the package. This can
be accomplished by taking advantage of the large ther-
mal pad on the underside of the IC. It is recommended
that multiple vias in the printed circuit board be used to
conduct heat away from the IC and into a copper plane
with as much area as possible.
Related Linear Technology Publications
Application notes 19, 35, 44, 76 and 88 contain more
detailed descriptions and design information for buck
regulators and other switching regulators. The LT1375 data
sheet has a more extensive discussion of output ripple,
loop compensation, and stability testing.
Figure 8. Suggested Layout
3570 F06
L2
D1 C
OUT
HIGH
FREQUENCY
CIRCULATING
PATH
C
IN
LOAD
LT3570
3750 F07
L2
LT3570
D1
C
OUT
C
IN
HIGH
FREQUENCY
SWITCHING
PATH
LOAD
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參數描述
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LT3570IUF-PBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:1.5A Buck Converter, 1.5A Boost Converter and LDO Controller
LT3570IUF-TRPBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:1.5A Buck Converter, 1.5A Boost Converter and LDO Controller
LT3571EUD#PBF 功能描述:IC REG BOOST ADJ 0.47A 16QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 穩壓器 - DC DC 開關穩壓器 系列:- 標準包裝:250 系列:- 類型:降壓(降壓) 輸出類型:固定 輸出數:1 輸出電壓:1.2V 輸入電壓:2.05 V ~ 6 V PWM 型:電壓模式 頻率 - 開關:2MHz 電流 - 輸出:500mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:6-UFDFN 包裝:帶卷 (TR) 供應商設備封裝:6-SON(1.45x1) 產品目錄頁面:1032 (CN2011-ZH PDF) 其它名稱:296-25628-2
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