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參數資料
| 型號： | LTC4302IMS-1#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數： | 19/20頁 |
| 文件大小： | 298K |
| 描述： | IC BUFFER 2-WIRE BUS 10-MSOP |
| 標準包裝： | 2,500 |
| 類型： | 熱交換開關 |
| 應用： | 通用型緩沖器/總線擴展器 |
| 內部開關： | 是 |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應商設備封裝： | 10-MSOP |
| 包裝： | 帶卷 (TR) |
LTC4302-1/LTC4302-2
19
sn430212 430212fs
PACKAGE DESCRIPTIO
MSOP (MS) 0603
0.53 ?0.152
(.021 ?.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 0.27
(.007 .011)
TYP
0.127 ?0.076
(.005 ?.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90 ?0.152
(.193 ?.006)
0.497 ?0.076
(.0196 ?.003)
REF
8
9
10
7 6
3.00 ?0.102
(.118 ?.004)
(NOTE 3)
3.00 ?0.102
(.118 ?.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0? 6?TYP
DETAIL A
DETAIL A
GAUGE PLANE
5.23
(.206)
MIN
3.20 3.45
(.126 .136)
0.889 ?0.127
(.035 ?.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ?0.038
(.0120 ?.0015)
TYP
0.50
(.0197)
BSC
Repeater/Bus Extender Application
Users who wish to connect two 2-wire systems separated
by a distance can do so by connecting two LTC4302-1s
back-to-back as shown in Figure 16. The I
2
C specification
allows for 400pF maximum bus capacitance, severely
limiting the length of the bus. The SMBus specification
places no restriction on bus capacitance; however, the
limited impedances of devices connected to the bus re-
quire systems to remain small, if rise and fall time speci-
fications are to be met. The strong pull-up and pull-down
impedances of the LTC4302-1 are capable of meeting rise
and fall time specifications for up to 1nF of capacitance,
thus allowing much more interconnect distance. In this
situation, the differential ground voltage between the two
systems may limit the allowed distance because a valid
logic low voltage with respect to the ground at one end of
the system may violate the allowed V
OL
specification with
respect to the ground at the other end. In addition, the
connection circuitry offset voltages of the back-to-back
LTC4302-1s add together, directly contributing to the
same problem.
APPLICATIO S I FOR ATIO
U
U
U
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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| LTC4302IMS-2 | 功能描述:IC BUFFER BUS 2WR ADDRESS 10MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內部開關:是 電流限制:可調 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| LTC4302IMS-2#PBF | 功能描述:IC BUFFER 2-WIRE BUS 10-MSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內部開關:是 電流限制:可調 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| LTC4302IMS-2#TR | 功能描述:IC BUFFER BUS 2WR ADDRESS 10MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內部開關:是 電流限制:可調 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| LTC4302IMS-2#TRPBF | 功能描述:IC BUFFER 2-WIRE BUS 10-MSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內部開關:是 電流限制:可調 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| LTC4303CDD | 制造商:Linear Technology 功能描述:Hot Swappable Bus Buffer 8-Pin DFN EP |
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