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參數(shù)資料
| 型號： | MAX2365ETM+T |
| 廠商： | Maxim Integrated |
| 文件頁數(shù)： | 2/29頁 |
| 文件大小： | 460K |
| 描述： | IC TRANSMITTER QUAD 48TQFN-EP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 頻率： | 900MHz |
| 應(yīng)用： | 無線 LAN |
| 功率 - 輸出： | 9dBm |
| 電流 - 傳輸： | 90mA |
| 數(shù)據(jù)接口： | PCB，表面貼裝 |
| 天線連接器： | PCB，表面貼裝 |
| 電源電壓： | 2.7V ~ 3.3V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 48-WFQFN 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
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Complete Dual-Band
Quadrature Transmitters
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(MAX2361/MAX2363/MAX2365, SHDN = IDLE = TXGATE = high, V
GC
= 2.4V, R
BIAS
= 10k&, I
CC
CTRL is in power-up state, no AC
signals applied, V
CC
= +2.7V to +3.3V, V
BAT
= +2.7V to +4.5V, T
A
= -40癈 to +85癈, unless otherwise noted. Typical values are at
V
CC
= V
BAT
= +2.8V, T
A
= +25癈, and operating modes are defined in Table 9.)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND...........................................................-0.3V to +3.6V
RFL, RFH0, RFH1,
V
CCIFCP
, V
CCRFCP
, V
CCDRV
to GND..................-0.3V to +5.5V
DI, CLK, CS, GC, SHDN, TXGATE,
IDLE, LOCK to GND................................-0.3V to (V
CC
+ 0.3V)
AC Input Pins (IFINL_, IFINH_, Q_, I_, TANKL_, TANKH_,
REF, RFPLL, LOL, LOH)..........................................1.0V peak
Digital Input Current (SHDN, TXGATE, IDLE,
CLK, DI, CS) ................................................................?0mA
Continuous Power Dissipation (T
A
= +70癈)
48-Pin QFN-EP (derate 27mW/癈 above +70癈) ..............2.1W
Operating Temperature Range ...........................-40癈 to +85癈
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-65癈 to +150癈
Lead Temperature (soldering, 10s).................................+300癈
PARAMETER
CONDITIONS
MIN
TYP
MAX
NIT
V
CC
2.7
3.3
Operating Supply Voltage
V
BAT
2.7
4.5
V
V
GC
= 0.6V
50
82
V
GC
= 1.95V
55
90
P
RFH0
= +5dBm
114
MPL = 0
P
RFH1
= +5dBm
121
P
RFH0
= +8dBm
137
PCS mode
MPL = 1
P
RFH1
= +8dBm
146
V
GC
= 0.6V
48
78
V
GC
= 1.95V
53
86
MPL = 0, P
RFL
= +5dBm
102
Cellular
mode
MPL = 1, P
RFL
= +8dBm
126
V
GC
= 1.95V
75
85
FM mode
MPL = 1, P
RFL
= +11dBm
87
Addition for IFLO buffer
3.4
7.7
IDLE = low, PSS = 0
6
10
IDLE = low, PSS = 1
7.2
12.2
Operating Supply Current
TXGATE = low, RFPLL off
11
17
mA
Leakage Current
SHDN = low, RFH_, RFL, V
CCDRV
0.5
20
礎(chǔ)
Logic High
0.7V
CC
V
Logic Low
0.3V
CC
V
Logic Input Current
-5
+5
礎(chǔ)
GC Input Current
6
11
礎(chǔ)
GC Input Resistance During
Shutdown
SHDN = low
215
340
k&
Lock Indicator High
100k& pullup load
V
CC
- 0.4
V
Lock Indicator Low
100k& pullup load
1.0
V
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