- 您現(xiàn)在的位置：買賣IC網(wǎng) > Datasheet目錄43 > MAX5930AEEG+ (Maxim Integrated)IC HOT SWAP CTLR PWR SEQ 24QSOP Datasheet資料下載
參數(shù)資料
| 型號(hào)： | MAX5930AEEG+ |
| 廠商： | Maxim Integrated |
| 文件頁數(shù)： | 21/23頁 |
| 文件大小： | 331K |
| 描述： | IC HOT SWAP CTLR PWR SEQ 24QSOP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 類型： | 熱交換控制器 |
| 應(yīng)用： | 通用 |
| 內(nèi)部開關(guān)： | 無 |
| 電源電壓： | 1 V ~ 15 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SSOP（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-QSOP |
| 包裝： | 管件 |
Layout Considerations
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep all
traces as short as possible and to maximize the high-cur-
rent trace dimensions to reduce the effect of undesirable
parasitic inductance. Place the MAX5930A/
MAX5931A/MAX5931B close to the cards connector.
Use a ground plane to minimize impedance and induc-
tance. Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections (Figure 13).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads
to the ground plane through vias, and use enlarged
copper mounting pads on the topside of the board.
Low-Voltage, Triple, Hot-Swap Controllers/
Power Sequencers/Voltage Trackers
______________________________________________________________________________________ 21
Figure 13. Kelvin Connection for the Current-Sense Resistors
SENSE RESISTOR
HIGH-CURRENT PATH
MAX5930A
MAX5931A
MAX5931B
Figure 12. Using the MAX5930A/MAX5931A/MAX5931B on a
Backplane
ON_
IN_
GATE_
V
IN
V
OUT
SENSE_
MAX5930A
MAX5931A
MAX5931B
C
BOARD
BACKPLANE
POWER
SUPPLY
REMOVABLE CARD
WITH NO HOT-INSERTION
PROTECTION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX5932ESA+T | IC HOT-SWAP CONTROLLER 8-SOIC |
| MAX5933EESA+ | IC HOT-SWAP CONTROLLER 8-SOIC |
| MAX5934EEE+ | IC HOT-SWAP CONTROLLER 16-QSOP |
| MAX5935EAX+ | IC CTRLR POWER QUAD 36-SSOP |
| MAX5937LCESA+ | IC HOT-SWAP CTRLR -48V 8-SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX5930AEEG+ | 功能描述:熱插拔功率分布 Triple Hot-Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5930AEEG+T | 功能描述:熱插拔功率分布 Triple Hot-Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5930EEG | 功能描述:熱插拔功率分布 RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5930EEG+ | 功能描述:熱插拔功率分布 Integrated Circuits (ICs) RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5930EEG+T | 功能描述:熱插拔功率分布 Integrated Circuits (ICs) RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。