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參數資料
| 型號： | MAX9776EVKIT+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數： | 27/38頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVALUATION KIT FOR MAX9776 |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 1 |
| 系列： | DirectDrive® |
| 放大器類型： | D 類 |
| 輸出類型： | 1-通道（單聲道），帶立體聲耳機 |
| 在某負載時最大輸出功率 x 通道數量： | 1.5W x 1 @ 4 歐姆; 60mW x 2 @ 16 歐姆 |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | MAX9776 |
| 已供物品： | 板，CD |
| 相關產品： | MAX9776EBX+TG45-ND - IC AMP AUDIO PWR 1.5W MONO 36WLP MAX9776ETJ+T-ND - IC AMP AUDIO PWR 1.5W D 32TQFN MAX9776ETJ+-ND - IC AMP AUDIO PWR 1.5W D 32TQFN |
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MAX9775/MAX9776
2 x 1.5W, Stereo Class D Audio Subsystem
with DirectDrive Headphone Amplifier
______________________________________________________________________________________
33
Table 12. Suggested Capacitor Manufacturers
SUPPLIER
PHONE
FAX
WEBSITE
Taiyo Yuden
800-348-2496
847-925-0899
www.t-yuden.com
TDK
807-803-6100
847-390-4405
www.component.tdk.com
Charge-Pump Capacitor Selection
Use capacitors with an ESR less than 100m
Ω for opti-
mum performance. Low-ESR ceramic capacitors mini-
mize the output resistance of the charge pump. Most
surface-mount ceramic capacitors satisfy the ESR
requirement. For best performance over the extended
temperature range, select capacitors with an X7R dielec-
tric or better. Table 12 lists suggested manufacturers.
Flying Capacitor (C1)
The value of the flying capacitor (C1) affects the output
resistance of the charge pump. A C1 value that is too
small degrades the device’s ability to provide sufficient
current drive, which leads to a loss of output voltage.
Increasing the value of C1 reduces the charge-pump out-
put resistance to an extent. Above 1F, the on-resistance
of the switches and the ESR of C1 and C2 dominate.
Output Capacitor (C2)
The output capacitor value and ESR directly affect the
ripple at CPVSS. Increasing the value of C2 reduces
output ripple. Likewise, decreasing the ESR of C2
reduces both ripple and output resistance. Lower
capacitance values can be used in systems with low
maximum output power levels. See the Output Power
vs. Load Resistance and Charge-Pump Capacitor Size
graph in the
Typical Operating Characteristics.
CPVDD Bypass Capacitor (C3)
The CPVDD bypass capacitor (C3) lowers the output
impedance of the power supply and reduces the
impact of the MAX9775/MAX9776’s charge-pump
switching transients. Bypass CPVDD with C3 to PGND
and place it physically close to the CPVDD and PGND.
Use a value for C3 that is equal to C1.
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Large traces also aid in mov-
ing heat away from the package. Proper grounding
improves audio performance, minimizes crosstalk
between channels, and prevents any switching noise
from coupling into the audio signal. Connect PGND and
GND together at a single point on the PCB. Route all
traces that carry switching transients away from GND
and the traces/components in the audio signal path.
Connect all of the power-supply inputs (CPVDD, VDD,
and PVDD) together. Bypass CPVDD with a 1F capaci-
tor to CPGND. Bypass VDD with 1F capacitor to GND.
Bypass PVDD with a 1F capacitor in parallel with a
0.1F capacitor to PGND. Place the bypass capacitors
as close to the MAX9775/MAX9776 as possible. Place
a bulk capacitor between PVDD and PGND if needed.
Use large, low-resistance output traces. Current drawn
from the outputs increases as load impedance
decreases. High output trace resistance decreases the
power delivered to the load. Large output, supply, and
GND traces also allow more heat to move from the
MAX9775/MAX9776 to the PCB, decreasing the thermal
impedance of the circuit.
TQFN Applications Information
The MAX9776 TQFN-EP package features an exposed
thermal pad on its underside. This pad lowers the
package’s thermal impedance by providing a direct
heat conduction path from the die to the PCB. The
exposed pad is internally connected to GND. Connect
the exposed thermal pad to the PCB GND plane.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information of reliability
testing results, refer to Application Note 1891:
Understanding the Basics of the Wafer-Level Chip-
Scale Package (WL-CSP) available on Maxim’s website
at www.maxim-ic.com/ucsp.
WLP Thermal Consideration
When operating at maximum output power, the WLP
thermal dissipation can become a limiting factor. The
WLP package does not dissipate as much power as a
TQFN and as a result will operate at a higher tempera-
ture. At peak output power into a 4
Ω load, the
MAX9775/MAX9776 can exceed its thermal limit, trig-
gering thermal protection. As a result, do not choose
the WLP package when maximum output power into 4
Ω
is required.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MAX9776EVKIT+ | 功能描述:音頻 IC 開發工具 MAX9776 Eval Kit RoHS:否 制造商:Texas Instruments 產品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| MAX9777ETI+ | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9777ETI+T | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9778ETI+ | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9778ETI+T | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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