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參數(shù)資料
| 型號(hào)： | MC100H604FNR2 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | Registered Hex TTL/ECL Translator |
| 中文描述： | HEX TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大小： | 97K |
| 代理商： | MC100H604FNR2 |
MC10H604 MC100H604
MOTOROLA
MECL Data
DL122 — Rev 6
2–304
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
–N–
–M–
–L–
V
W
D
D
Y BRK
28
1
VIEW S
S
L–M
S
0.010 (0.250)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
0.004 (0.100)
SEATING
PLANE
G1
G
J
C
Z
R
E
A
S
L–M
M
0.007 (0.180)
N
S
T
–T–
B
S
L–M
S
0.010 (0.250)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
U
S
L–M
M
0.007 (0.180)
N
S
T
Z
G1
X
VIEW D–D
S
L–M
M
0.007 (0.180)
N
S
T
K1
VIEW S
H
K
F
S
L–M
M
0.007 (0.180)
N
S
T
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
0.485
0.485
0.165
0.090
0.013
0.050 BSC
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
2
0.410
0.040
MAX
0.495
0.495
0.180
0.110
0.019
MIN
12.32
12.32
4.20
2.29
0.33
MAX
12.57
12.57
4.57
2.79
0.48
MILLIMETERS
INCHES
1.27 BSC
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
2
10.42
1.02
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.430
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
10.92
–––
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC100H604FNR2G | 功能描述:轉(zhuǎn)換 - 電壓電平 Registered HEX TTL to ECL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC100H605FN | 功能描述:轉(zhuǎn)換 - 電壓電平 Registered HEX RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC100H605FNG | 功能描述:轉(zhuǎn)換 - 電壓電平 Registered HEX ECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC100H605FNR2 | 功能描述:轉(zhuǎn)換 - 電壓電平 Registered HEX RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC100H605FNR2G | 功能描述:轉(zhuǎn)換 - 電壓電平 Registered HEX ECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
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