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參數(shù)資料
型號(hào)： MC56F8356
廠商： Motorola, Inc.
英文描述： 56F8356 16-bit Hybrid Controller
中文描述： 56F8356 16位混合控制器
文件頁數(shù)： 125/160頁
文件大小： 1380K
代理商： MC56F8356
General Characteristics
56F8356 Technical Data
Preliminary
125
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
R
θ
JA
) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on a
thermal test board with two internal planes (2s2p, where “s” is the number of signal layers and “p” is the number
of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the
non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
θ
JC
), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Thermal Characterization Parameter, Psi-JT (
Ψ
JT
), is the "resistance" from junction to reference point
thermocouple on top center of case as defined in JESD51-2.
Ψ
JT
is a useful value to use to estimate junction
temperature in steady-state customer environments.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
See
Section 12.1
for more details on thermal design considerations.
2.
3.
4.
5.
6.
Table 10-2 Electrostatic Discharge Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
—
V
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
500
—
—
V
Table 10-3 Thermal Characteristics
6
Characteristic
Comments
Symbol
Value
Unit
Notes
144-pin LQFP
Junction to ambient
Natural convection
R
θ
JA
47.1
°C/W
2
Junction to ambient (@1m/sec)
R
θ
JMA
43.8
°C/W
2
Junction to ambient
Natural convection
Four layer board
(2s2p)
R
θ
JMA
(2s2p)
40.8
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board
(2s2p)
R
θ
JMA
39.2
°C/W
1,2
Junction to case
R
θ
JC
11.8
°C/W
3
Junction to center of case
Ψ
JT
1
°C/W
4, 5
I/O pin power dissipation
P
I/O
User-determined
W
Power dissipation
P
D
P
D
= (I
DD
x V
DD
+ P
I/O
)
W
Maximum allowed P
D
P
DMAX
(TJ - TA) /
θ
JA
°C
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8356MFV60 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC56F8356MFVE 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8356VFV60 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8356VFVE 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8357 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-BIT HYBRID CONTROLLERS
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