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參數資料
型號: MC68HC901
廠商: Motorola, Inc.
英文描述: Multi-Function Peripheral
中文描述: 多功能外設
文件頁數: 55/73頁
文件大小: 274K
代理商: MC68HC901
Electrical Characteristics
8-2
MC68HC901 USER’S MANUAL
MOTOROLA
8.3 POWER CONSIDERATIONS
The average chip-junction temperature, T
J
, in
C can be obtained from:
T
J
= T
A
+ (P
D
θ
JA
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (1)
where:
T
θ
P
P
P
A
JA
D
INT
I/O
= Ambient Temperature,
= Package Thermal Resistance, Junction-to-Ambient,
= P
INT
+ P
I/O
= I
CC
x V
CC
, Watts — Chip Internal Power
= Power Dissipation on Input and Output Pins, Watts — User Determined
C
C/W
For most applications P
I/O
< P
INT
and can be neglected.
An appropriate relationship between P
D
and T
J
(if P
I/O
is neglected) is:
P
D
= K
÷
(T
J
+ 273
C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (2)
Solving equations (1) and (2) for K gives:
K = P
D
(T
A
+ 273
C) +
θ
JA
P
D2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (3)
where K is a constant pertaining to the particular part. K can be determined from equation
(3) by measuring P
D
(at equilibrium) for a known T
and T
J
can be obtained by solving equations (1) and (2) iteratively for any value of T
A
. Using this value of K, the values of P
D
A
.
The total thermal resistance of a package (
and
θ
CA
, representing the barrier to heat flow from the semiconductor junction to the
package (case) surface (
θ
JC
) and from the case to the outside ambient (
are related by the equation:
θ
JA
) can be separated into two components,
θ
JC
θ
CA
). These terms
θ
JA
=
θ
JC
+
θ
CA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (4)
θ
and can be minimized by such thermal management techniques as heat sinks, ambient air
cooling and thermal convection. Thus, good thermal management on the part of the user
can significantly reduce
θ
CA
so that
θ
JA
approximately equals
in equation (1) will result in a lower semiconductor junction temperature.
JC
is device related and cannot be influenced by the user. However,
θ
CA
is user dependent
θ
JC
. Substitution of
θ
JC
for
θ
JA
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