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參數(shù)資料
| 型號(hào)： | MCM63L836A |
| 廠商： | Motorola, Inc. |
| 英文描述： | 8MBit Synchronous Late Write Fast Static RAM(8M位同步遲寫(xiě)快速靜態(tài)RAM) |
| 中文描述： | 8MBit快速同步后寫(xiě)入靜態(tài)存儲(chǔ)器（800萬(wàn)位同步遲寫(xiě)快速靜態(tài)內(nèi)存） |
| 文件頁(yè)數(shù)： | 19/20頁(yè) |
| 文件大?。?/td> | 412K |
| 代理商： | MCM63L836A |
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MCM63L836A
MCM63L918A
19
MOTOROLA FAST SRAM
MCM
63L918A
XX
X
X
Motorola Memory Prefix
Part Number
R = Tape and Reel, Blank = Tray
Package (FC = Flipped Chip PBGA)
Speed (3.8 = 3.8 ns, 4.0 = 4.0 ns, 4.2 = 4.2 ns,
4.5 = 4.5 ns, 5.0 = 5.0 ns)
ORDERING INFORMATION
(Order by Full Part Number)
63L836A
Full Part Numbers — MCM63L836AFC3.8
MCM63L918AFC3.8
MCM63L918AFC4.0
MCM63L918AFC4.2
MCM63L918AFC4.5
MCM63L918AFC5.0
MCM63L836AFC3.8R
MCM63L836AFC4.0R
MCM63L836AFC4.2R
MCM63L836AFC4.5R
MCM63L836AFC5.0R
MCM63L918AFC3.8R
MCM63L918AFC4.0R
MCM63L918AFC4.2R
MCM63L918AFC4.5R
MCM63L918AFC5.0R
MCM63L836AFC4.0
MCM63L836AFC4.2
MCM63L836AFC4.5
MCM63L836AFC5.0
FC PACKAGE
7 X 17 BUMP PBGA
CASE 999D–01
PACKAGE DIMENSIONS
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
119X
BOTTOM VIEW
D
0.2
7
6
5
4
3
2
1
b
0.15
A
E
E2
D2
C
B
e
0.3
A B C
E3
D3
INDEX
5
4X
TOP VIEW
16X
M
M
e
6X
E1
D1
3
A
SEATING
PLANE
SIDE VIEW
A1
A2
A3
A4
0.2 A
0.35 A
0.25 A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M1992.
2. ALL DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUMSOLDER BALL
DIAMETER MEASURED PARALLEL TO DATUM
PLANE A.
4. DATUMA, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. AN AI INDEX MARK WILL BE LOCATED IN THIS
AREA.
6. D2 AND E2 DEFINE THE AREA OCCUPIED BY
THE DIE. D3 AND E3 ARE THE MINIMUM
CLEARANCE FROMTHE PACKAGE EDGE TO THE
CHIP CAPACITORS.
7. CAPACITORS MAY NOT BE PRESENT ON ALL
DEVICES.
8. CAUTION MUST BE TAKEN NOT TO SHORT
EXPOSED METAL CAPACITOR PADS ON
PACKAGE TOP.
DIM
A
A1
A2
A3
A4
D
D1
D2
D3
E
E1
E2
E3
b
e
MIN
–––
0.50
1.75
0.80
0.92
22.00 BSC
20.32 BSC
12.10
1.10
14.00 BSC
7.62 BSC
7.26
1.10
0.60
1.27 BSC
MAX
2.77
0.70
2.07
0.92
1.15
MILLIMETERS
12.40
7.46
0.90
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