- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄374423 > MDM-25SBSP- (ITT Corporation) Micro-D PCB - .050 Contact Spacing PDF資料下載
參數(shù)資料
| 型號： | MDM-25SBSP- |
| 廠商： | ITT Corporation |
| 英文描述： | Micro-D PCB - .050 Contact Spacing |
| 中文描述： | 微D板- .050聯(lián)系間距 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大小： | 197K |
| 代理商： | MDM-25SBSP- |
Micro-D PCB - .050" Contact Spacing
MDM-PCB
How to Order - MDM-PCB Series
18
www.ittcannon.com
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
MDM-PCB connectors are designed for use
with flex circuitry, flat cable and printed circuit
boards or multi-layer boards. They use the
standard MDM metal shell and provide high
density and high reliability in board-to-board,
board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell
sizes with 9 to 100 contacts. Terminations
may be straight (BS) or at 90 right angle (BR,
CBR) board thickness. Jackpost mounting for
use with locking hardware is also available.
SERIES
INSULATOR MATERIAL
CONTACT ARRANGEMENT
CONTACT TYPE
TERMINATION TYPE
MOUNTING HARDWARE (Shell Flange)
MOUNTING HARDWARE FOR PCB
TERMINATION TAIL LENGTH MODIFICATION CODE
SHELL FINISH MODIFICATION CODES
SERIES
MDM - Micro "D" Metal Shell
MOUNTING HARDWARE FOR PCB
T - Threaded Insert
#2-56 Thd for Shell Sizes 9 thru 51
#4-40 Thd for Shell Size 100
No letter - none
TERMINATION TAIL LENGTH MODIFICATION CODE
None - .109 (2.77) ±.015 (0.38) Standard
L61 - .125 (3.18)
L56 - .150 (3.81)
L57 - .190 (4.83)
L39 - .250 (6.35)
L58 - .375 (9.52)
SHELL FINISH MODIFICATION CODES
None - Yellow Chromate/Cadmium over Nickel
A174 - Electroless Nickel
A172 - Gold over Nickel
A141 - Irridite/Alodine
A30 - Black Anodize
INSULATOR MATERIAL
Liquid Crystal Polymer (LCP)
CONTACT ARRANGEMENT
9, 15, 21, 25, 31, 37, 51, and 100
CONTACT TYPE
P - Pin (Plug)
S - Socket (Receptacle)
TERMINATION TYPE
BS - Straight PCB Termination
BR - Right Angle PCB Termination
CBR - Right Angle Narrow Profile PCB Terminations
MOUNTING HARDWARE (Shell Flange)
P
- Jackposts
M7 - Jackposts
M83513/5-07 (Sizes 9-51)
M17 - Jackposts
M83513/5-17 (Size 100)
No letter - none
(For special modification codes, consult
customer service.)
NOTE: Back molding material –
Epoxy Hysol #MG40FS
MDM * -
-
25
P
P
BS
T
L39
A174
RoHS COMPLIANCE
R
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MDM-25SBSP-A174 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-L58A141 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-L61 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-L61A174 | Micro-D PCB - .050 Contact Spacing |
| MDM-25SBSP-T | Micro-D PCB - .050 Contact Spacing |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MDM-25SBSP-5 | 制造商:ITT Interconnect Solutions 功能描述:Conn D-Subminiature SKT 25 POS 2.54mm Solder ST Thru-Hole 25 Terminal 1 Port |
| MDM-25SBSP-8 | 制造商:ITT Interconnect Solutions 功能描述:Conn D-Subminiature SKT 25 POS 2.54mm Solder ST Thru-Hole 25 Terminal 1 Port |
| MDM-25SBSP-A141 | 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 25 POS Solder ST Thru-Hole 25 Terminal 1 Port |
| MDM-25SBSP-A172 | 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 25 POS Solder ST Thru-Hole 25 Terminal 1 Port |
| MDM-25SBSP-A174 | 功能描述:MICRO 25POS SKT STR PCB RoHS:否 類別:連接器，互連式 >> D-Sub 系列:Micro D 金屬外殼 (MDM) 標準包裝:1 系列:Combo D®, D*M 連接器類型:D-Sub，組合式 位置數(shù):25 行數(shù):2 外殼尺寸，連接器布局:4（DC，C）- 25W3 觸點類型：:信號和同軸或電源（未包括） 連接器類型:插頭，公引腳 安裝類型:面板安裝，通孔 法蘭特點:體座/外殼（無螺紋） 端子:焊接 特點:屏蔽 外殼材料，表面處理:鋼，帶黃色鉻酸鹽鋅鍍層 觸點表面涂層:金 觸點涂層厚度:閃光 防護等級:- 工作溫度:-55°C ~ 125°C 額定電壓:- 額定電流:7.5A 體座材料:聚酯 顏色:黑 其它名稱:IDCM25W3PZ |
發(fā)布緊急采購，3分鐘左右您將得到回復。