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參數資料
型號: MMUN2113LT3
廠商: ON SEMICONDUCTOR
元件分類: 小信號晶體管
英文描述: 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
封裝: CASE 318-08, TO-236, 3 PIN
文件頁數: 1/13頁
文件大小: 152K
代理商: MMUN2113LT3
Semiconductor Components Industries, LLC, 2008
December, 2008 Rev. 9
1
Publication Order Number:
MMUN2111LT1/D
MMUN2111LT1 Series
Preferred Devices
Bias Resistor Transistors
PNP Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base-emitter
resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the SOT-23
package which is designed for low power surface mount applications.
Features
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SOT-23 package can be soldered using wave or reflow. The
modified gull-winged leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
Available in 8 mm embossed tape and reel.
PbFree Packages are Available
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
Collector Current
IC
100
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD
246 (Note 1)
400 (Note 2)
2.0 (Note 1)
3.2 (Note 2)
mW
mW/°C
Thermal Resistance,
Junction-to-Ambient
RqJA
508 (Note 1)
311 (Note 2)
°C/W
Thermal Resistance,
Junction-to-Lead
RqJL
174 (Note 1)
208 (Note 2)
°C/W
Junction and Storage,
Temperature Range
TJ, Tstg
55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR4 @ Minimum Pad
2. FR4 @ 1.0 x 1.0 inch Pad
SOT23
CASE 318
STYLE 6
MARKING
DIAGRAM
1
3
2
Preferred devices are recommended choices for future use
and best overall value.
PIN 3
COLLECTOR
(OUTPUT)
PIN 2
EMITTER
(GROUND)
PIN 1
BASE
(INPUT)
R1
R2
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
http://onsemi.com
1
A6x M G
G
A6x
= Device Code
x
= A L (Refer to page 2)
M
= Date Code*
G
= PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Device
Package
Shipping
ORDERING INFORMATION
MMUN21xxLT1
SOT23
3000/Tape & Reel
MMUN21xxLT3G
SOT23
(PbFree)
10000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MMUN21xxLT1G
SOT23
(PbFree)
3000/Tape & Reel
MMUN21xxLT3
SOT23
10000/Tape & Reel
相關PDF資料
PDF描述
MMUN2216LT3 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
MMUN2241LT3 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
MMUN2212LT3G 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
MMUN2214LT3 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
MMUN2212LT3 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
相關代理商/技術參數
參數描述
MMUN2113LT3G 功能描述:開關晶體管 - 偏壓電阻器 SS BR XSTR PNP 50V RoHS:否 制造商:ON Semiconductor 配置: 晶體管極性:NPN/PNP 典型輸入電阻器: 典型電阻器比率: 安裝風格:SMD/SMT 封裝 / 箱體: 直流集電極/Base Gain hfe Min:200 mA 最大工作頻率: 集電極—發射極最大電壓 VCEO:50 V 集電極連續電流:150 mA 峰值直流集電極電流: 功率耗散:200 mW 最大工作溫度: 封裝:Reel
MMUN2113RLT1 制造商:LRC 制造商全稱:Leshan Radio Company 功能描述:Bias Resistor Transistor
MMUN2114 制造商:LRC 制造商全稱:Leshan Radio Company 功能描述:Bias Resistor Transistor
MMUN2114L 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Digital Transistors (BRT) R1 = 10 k, R2 = 47 k
MMUN2114LT1 功能描述:開關晶體管 - 偏壓電阻器 100mA 50V BRT PNP RoHS:否 制造商:ON Semiconductor 配置: 晶體管極性:NPN/PNP 典型輸入電阻器: 典型電阻器比率: 安裝風格:SMD/SMT 封裝 / 箱體: 直流集電極/Base Gain hfe Min:200 mA 最大工作頻率: 集電極—發射極最大電壓 VCEO:50 V 集電極連續電流:150 mA 峰值直流集電極電流: 功率耗散:200 mW 最大工作溫度: 封裝:Reel
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