
MICROCIRCUIT DATA SHEET
MNLMH6628-X-RH REV 0A0
(Absolute Maximum Ratings)
(Note 1)
Supply Voltage
+7V dc
Maximum Junction temperature
(Note 2)
+175 C
Lead temperature
Soldering, 10 seconds
Differential input voltage
+300 C
V+ - V-
Common mode input voltage
V+ - V-
Storage temperature range
-65 C < Ta < +150 C
Power Dissipation
(Note 2)
1.0W
Short circuit current
(Note 3)
Thermal Resistance
ThetaJA
Ceramic DIP (Still Air)
(500LF/Min Air Flow)
Ceramic SOIC (Still Air)
(500LF/Min Air Flow)
135 C/W
75 C/W
200 C/W
145 C/W
ThetaJC
Ceramic DIP
Ceramic SOIC
Package Weight
(typical)
Ceramic DIP
Ceramic SOIC
ESD Tolerance
(Note 4)
30 C/W
19 C/W
TBD
TBD
4000V
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Operating Ratings indicate conditions for which the device is intended to be
functional, but do not guarantee specific performance limits. For guaranteed
specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test
conditions.
The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to
ambient thermal resistance), and TA (ambient temperatuer). The maximum allowable
power dissipation at any temperatuer is Pdmax = (Tjmax -TA) / ThetaJA or the number
given in the Absoulute Maximum Ratings, whichever is lower.
Output is short circuit protected to ground, however maximum reliability is obtained
if output current does not exceed 160mA.
Human body model, 1.5k Ohms in series with 100pF.
Note 2:
Note 3:
Note 4:
3