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參數資料
| 型號： | NAND512R3A0BN6E |
| 廠商： | 意法半導體 |
| 英文描述： | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| 中文描述： | 128兆，256兆，512兆位，1千兆位（x8/x16）528 Byte/264字的頁面，1.8V/3V，NAND閃存芯片 |
| 文件頁數： | 25/57頁 |
| 文件大?。?/td> | 410K |
| 代理商： | NAND512R3A0BN6E |
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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
Page Program
The Page Program operation is the standard oper-
ation to program data to the memory array.
The main area of the memory array is pro-
grammed by page, however partial page program-
ming is allowed where any number of bytes (1 to
528) or words (1 to 264) can be programmed.
The maximum number of consecutive partial page
program operations allowed in the same page is
three. After exceeding this a Block Erase com-
mand must be issued before any further program
operations can take place in that page.
Before starting a Page Program operation a Point-
er operation can be performed to point to the area
to be programmed. Refer to the
Pointer Opera-
tions
section and
Figure 12.
for details.
Each Page Program operation consists of five
steps (see
Figure 17.
):
1.
one bus cycle is required to setup the Page
Program command
2.
four bus cycles are then required to input the
program address (refer to
Table 6.
)
3.
the data is then input (up to 528 Bytes/ 264
Words) and loaded into the Page Buffer
one bus cycle is required to issue the confirm
command to start the P/E/R Controller.
The P/E/R Controller then programs the data
into the array.
Once the program operation has started the Sta-
tus Register can be read using the Read Status
Register command. During program operations
the Status Register will only flag errors for bits set
to '1' that have not been successfully programmed
to '0'.
During the program operation, only the Read Sta-
tus Register and Reset commands will be accept-
ed, all other commands will be ignored.
Once the program operation has completed the P/
E/R Controller bit SR6 is set to ‘1’ and the Ready/
Busy signal goes High.
The device remains in Read Status Register mode
until another valid command is written to the Com-
mand Interface.
4.
5.
Figure 17. Page Program Operation
Note: Before starting a Page Program operation a Pointer operation can be performed. Refer to
Pointer Operations
section for details.
I/O
RB
Address Inputs
SR0
ai07566
Data Input
10h
70h
80h
Page Program
Setup Code
Confirm
Code
Read Status Register
Busy
(Program Busy time)
相關PDF資料 |
PDF描述 |
|---|---|
| NAND512R3A0CZB6T | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| NAND512R3A2BZA1F | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| NAND512R3A2BZA1T | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| NAND512R3A2BZB1E | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| NAND512R3A2CZA6T | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
相關代理商/技術參數 |
參數描述 |
|---|---|
| NAND512R3A2AZA6E | 功能描述:IC FLASH 512MBIT 55VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M（64M x 8） 速度:- 接口:并聯 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應商設備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
| NAND512R3A2BZA6E | 功能描述:閃存 128Mbit-1Gbit 1.8/3V RoHS:否 制造商:ON Semiconductor 數據總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| NAND512R3A2CZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 產品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應商設備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| NAND512R3A2CZA6F | 制造商:Micron Technology Inc 功能描述:SLC NAND Flash Parallel 1.8V 512Mbit 64M x 8bit 15us 63-Pin VFBGA T/R |
| NAND512R3A2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
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