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參數資料
型號: NUP4103FCT1G
廠商: ON SEMICONDUCTOR
元件分類: 數據傳輸濾波器
英文描述: Four Channel ESD Array
中文描述: 4 FUNCTIONS, DATA LINE FILTER
文件頁數: 1/5頁
文件大小: 142K
代理商: NUP4103FCT1G
Semiconductor Components Industries, LLC, 2006
March, 2006
Rev. 1
1
Publication Order Number:
NUP4103FC/D
NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
Features
Unidirectional, Quad ESD Protection
Ultra
small Flip
Chip Packaging (0.95 mm x 1.33 mm)
Compliance with IEC61000
4
2 (Level 4) Requirements
Maximum Leakage Current of 100 nA at 3.3 V
Pb
Free Package is Available*
Benefits
Protects Four Data Lines from ESD while Reducing Component
Count
Small Package Saves on PCB Real Estate
Provides Protection for ESD Industry Standards, IEC 61000,
HBM and MM
Low Leakage Capability Minimizes Power Loss in the System
Applications
ESD Protection for Portable Equipment
Cell Phones
MP3 Players
PDAs
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ESD Discharge IEC61000
4
2,
Air Discharge
Contact Discharge
Human Body Model
Machine Model
V
PP
30
30
16
1.6
kV
Junction Temperature
T
J
150
°
C
Operating Ambient Temperature Range
T
A
40 to +85
°
C
Storage Temperature Range
T
STG
55 to +150
°
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb
Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
ORDERING INFORMATION
NUP4103FCT1
Flip
Chip
3000/Tape & Reel
CIRCUIT DESCRIPTION
A1
C1
A3
C3
B2
A
B
C
A
B
C
1 2
1
2
TOP VIEW
(Bumps Down)
BOTTOM VIEW
(Bumps Up)
3
3
è
è
E M
E
M
= Specific Device Code
= Date Code
= Pb
Free Package
(Note: Microdot may be in either location)
MARKING
DIAGRAM
1
5
PIN FLIP
CHIP CSP
PLASTIC
CASE 766AB
NUP4103FCT1G
Flip
Chip
(Pb
Free)
3000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Shipping
http://onsemi.com
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