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參數資料
| 型號： | P14827EJ1V0AN00 |
| 英文描述： | uPB1005K RF/IF Down-Converter+PLL Frequency Synthesizer ICs for GPS Receivers |
| 中文描述： | uPB1005K射頻/中頻下變頻器鎖相環頻率合成器的GPS接收機 |
| 文件頁數： | 5/23頁 |
| 文件大小： | 188K |
| 代理商： | P14827EJ1V0AN00 |
Preliminary Application Note P14822EJ2V0AN
5
1. PREFACE
In 1995, PDC (Personal Digital Cellular) services were launched in Japan, and PHS (Personal Handyphone
System) services were started soon afterward. As of February 2001, Japan's cell phone subscriptions totaled about
59.5 million, indicating that almost half (47.2 percent) of the people in Japan has a call phone. PHS subscriptions
alone totaled over 5.8 million, which represents about 4.6 percent of the nation's population.
Since mobile telephones use high frequencies, a frequency-raising function is needed for signal transmission.
Methods for raising the frequency include direct modulation methods (such as the direct modulation method and the
RF modulation method), in which a signal is increased to the transmission frequency and then the frequency is
modulated, and indirect modulation methods (such as the up-converter method and the IF modulation method), in
which the frequency of a pre-modulated signal is raised to obtain the transmission frequency. Frequency up-
converters are used in all of these methods. NEC has developed silicon monolithic ICs as core products for
frequency up-converters used with any of the above frequency modulation methods, and has added the new
μ
PC8172TB and
μ
PC8187TB to its product series. This Application Note describes usage and applications of these
new products.
2. PRODUCT OVERVIEW
2.1 Product Overview
The
μ
PC8172TB and
μ
PC8187TB are process-renewal products that have the same circuit configuration as the
existing
μ
PC8106 and
μ
PC8163TB respectively but are produced using the latest manufacturing process. These
products are manufactured by using NEC's proprietary "UHS0" (Ultra High Speed Process) silicon bipolar process
with f
max
= 30 GHz.
The pin layout is the same as that of the existing product. The product series uses only 6-pin super minimold (2012
size) packages with C3A or C3G for the
μ
PC8172TB or
μ
PC8187TB marking respectively.
Figure 2-1 shows a package drawing of the 6-pin super minimold.
Figure 2-1. Package Drawing of 6-pin Super Minimold (Unit: mm)
0
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0
0
0
0
+
–
2
±
0
1
0
0
0
+
–
2.1
±
0.1
1.25
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0.1
0.1 MIN.
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