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參數(shù)資料
| 型號： | P89LPC922 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | MINIATURE POWER RELAY |
| 中文描述： | 8位微控制器兩個小時80C51的核心2鍵盤/ 4 KB的/ 8 KB的3伏的低功耗Flash 256 - RAM的字節(jié)數(shù)據(jù) |
| 文件頁數(shù)： | 43/45頁 |
| 文件大小： | 877K |
| 代理商： | P89LPC922 |
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Philips Semiconductors
P89LPC920/921/922
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 06 — 21 November 2003
43 of 45
9397 750 12285
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
15. Revision history
Table 13:
Rev Date
06
Revision history
CPCN
20031121
Description
Product data (9397 750 12285); ECN 853-2403 01-A14557 of 18 November 2003
Modification:
Table 8 “DC electrical characteristics” on page 35
: I
TL
V
IN
conditions, changed value from
1.5 V to 2.0 V
Product data (9397 750 12121); ECN 853-2403 30391 of 30 September 2003
Product data (9397 750 11945); ECN 853-2403 30305 of 5 September 2003
Preliminary data (9397 750 11786)
Objective data (9397 750 11532)
Preliminary data (9397 750 11387)
-
05
04
03
02
01
20031007
20030909
20030811
20030522
20030505
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參數(shù)描述 |
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| P89LPC9221FDH,512 | 功能描述:8位微控制器 -MCU 80C51 8K FL 256B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC9221FDH,518 | 功能描述:8位微控制器 -MCU 8B MCU 80C51 2/4/8KB 3V FL 256B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC9221FN | 功能描述:8位微控制器 -MCU 80C51 8K FL 256B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC9221FN,112 | 功能描述:8位微控制器 -MCU 8K FL/256B RAM/I2C/UART/DIP20 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC9222A1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 2 kB/4 kB/8 kB 3 V byte-erasable flash with 8-bit ADC |
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