- 您現(xiàn)在的位置：買(mǎi)賣IC網(wǎng) > PDF目錄382380 > PCD5013H (NXP SEMICONDUCTORS) FLEX roaming decoder II PDF資料下載
參數(shù)資料
| 型號(hào)： | PCD5013H |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 尋呼電路 |
| 英文描述： | FLEX roaming decoder II |
| 中文描述： | TELECOM, PAGING DECODER, PQFP32 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-358-1, LQFP-32 |
| 文件頁(yè)數(shù)： | 72/76頁(yè) |
| 文件大小： | 270K |
| 代理商： | PCD5013H |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)當(dāng)前第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)
1999 Apr 12
72
Philips Semiconductors
Product specification
FLEX
roaming decoder II
PCD5013
17.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(2)
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
suitable
suitable
suitable
suitable
suitable
suitable
not recommended
(3)(4)
not recommended
(5)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCD5032 | ADPCM CODEC for digital cordless telephones |
| PCD5032H | ADPCM CODEC for digital cordless telephones |
| PCD5032T | ADPCM CODEC for digital cordless telephones |
| PCD5041 | DECT burst mode controller |
| PCD5041H | DECT burst mode controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCD5032 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ADPCM CODEC for digital cordless telephones |
| PCD5032B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Linear CODEC |
| PCD5032D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Linear CODEC |
| PCD5032H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ADPCM CODEC for digital cordless telephones |
| PCD5032T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ADPCM CODEC for digital cordless telephones |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。