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SBOS292A DECEMBER 2003 REVISED AUGUST 2004
www.ti.com
2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
PACKAGELEAD
PACKAGE
DRAWING
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT MEDIA,
QUANTITY
PGA309
TSSOP-16
PW
40
°
C to +125
°
C
PGA309
PGA309AIPWR
Tape and Reel, 2500
PGA309AIPWT
Tape and Reel, 250
(1)For the most current package and ordering information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range unless otherwise noted.
Supply Voltage, VSD, VSD
Input Voltage, VIN1, VIN2(2)
Input Current, VFB, VOUT
Input Current
Output Current Limit
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Lead Temperature (soldering, 10s)
ESD Protection (Human Body Model)
(1)Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
+7.0V
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0.3V to VSA +0.3V
±
150mA
±
10mA
50mA
60
°
C to +150
°
C
55
°
C to +150
°
C
+150
°
C
+300
°
C
4kV
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.