
8-33
8
F
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
V
B
I
C
GND
CELL LNA OUT
G
CELL LNA EMITTER
CELL LNA IN
GND
PCS LNA IN
M
P
G
T
E
V
/2 SELECT
CDMA-
CDMA+
FM-
FM+
I
PCS LO OUT
L
G
PCS LNA OUT
LO IN
I
I
1
3
6
4
5
2
9
14
10
13
11
12
32
27
31
28
30
29
24
22
19
21
20
23
26
25
7
8
15
16
18
17
CELL LO OUT
VCC2
/2
RF2489
DUAL-BAND/TRI-MODE CDMA
LOW NOISE AMPLIFIER/MIX ER
CDMA/Cellular/PCS Handsets
JCDMA/GPS Handsets
CDMA Modem/Data Cards
Commercial and Consumer Systems
Portable Battery-Powered Equipment
The RF2489 is a high performance CDMA dual-band/tri-
mode integrated LNA/mixer. The device is designed to
meet all IS-98 sensitivity, intermodulation and single-tone
requirements. The operating voltage is 2.7V and is com-
patible with 1.8V logic for control lines. The RF2489 inte-
grates the dual-band LNA/downconverters with 30dB of
gain control and TX LO buffers. Additionally, a divide-by-2
prescaler to allow the use of a single-band VCO is inte-
grated. The design is flexible, in that the bias currents
may be set using off-chip current reference resistors for
both the LNA and mixer blocks. The device is packaged in
a 5mmx5mm leadless plastic package.
30dB of Stepped LNA/Mixer Gain Control
Adjustable Mixer & LNA Bias Current/IIP3
A Divide-by-2 Prescaler
Meets IMD Tests with Three Gain States/
Two Logic Control Lines
Integrated TX LO Buffer Amplifiers
RF2489
RF2489
Dual-Band/Tri-Mode CDMA Low Noise Amplifier/Mixer
Dual-Band/Tri-Mode JCDMA/GPS Low Noise
Amplifier/Mixer
Fully Assembled Evaluation Board
RF2489 PCBA
8
Rev A10 011017
1.00
0.85
0.80
0.65
5.00
sq.
NOTES:
Shaded Pin is Lead 1.
1
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
0.30
0.18
3
0.60
0.24 typ
0.55
0.30
0.50
0.23
0.13
4 PLCS
0.05
0.01
3.25
2.95 sq.
12°
MAX
0.45
0.20
4 PLCS
Package S tyle: LCC , 32-Pin, 5 x 5