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參數(shù)資料
型號: RF2689
廠商: RF MICRO DEVICES INC
元件分類: 無繩電話/電話
英文描述: W-CDMA/GSM/DCS RECEIVE AGC AND DEMODULATOR
中文描述: TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC20
封裝: 4 X 4 MM, LCC-20
文件頁數(shù): 1/20頁
文件大小: 383K
代理商: RF2689
7-39
7
Q
D
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
7
M
Gain
Control
DIV2
Div
12 or 4
DIV2
I/Q
Cal
Mode Control
& Biasing
8
L
4
W-CDMA IN+
2
GSM IN+
6
V
20
V
1
V
17
I
18
14 I OUT+
15 CALEN
16 FCLK
11 Q OUT-
19 VREF2V
10
E
3
GSM IN-
5
W-CDMA IN-
9
M
12 Q OUT+
13 I OUT-
I
RF2689
W-CDMA/GS M/DCS RECE IVE AGC
AND DEMODULAT OR
Multimode W-CDMA/GSM/DCS/EDGE
W-CDMA Systems
GSM Systems
The RF2689 is an integrated complete IF AGC amplifier
and quadrature demodulator designed for the receive
section of W-CDMA and GSM/DCS applications. It is
designed to amplify received IF signals, while providing
70dB of gain control range, a total of 90dB gain, and
demodulate to baseband I and Q signals. This circuit is
designed as part of RFMD’s multimode W-CDMA/GSM/
DCS chipset, which also includes the RF2688 W-CDMA/
GSM/DCS transmit modulator and IF AGC/Upconverter.
The IC is manufactured on an advanced 25GHz F
T
Sili-
con Bi-CMOS process, and is packaged in a 20-pin,
4mmx4mm, leadless chip carrier.
Digitally Controlled Power Down Mode
2.7V to 3.3V Operation
Digital LO Quadrature Divide-by-8
IF AGC Amp with 70dB Gain Control
80dB Maximum Voltage Gain
RF2689
RF2689 PCBA
W-CDMA/GSM/DCS Receive AGC and Demodulator
Fully Assembled Evaluation Board
7
Rev A4 010815
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
0.13
4 PLCS
0.50
2.10
sq.
0.65
4 PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Shaded lead is Pin 1.
1
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package S tyle: LCC , 20-Pin, 4 x 4
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